TLP2630Alternatives & Equivalent Parts
About TLP2630
TLP2630 is a Integrated Circuit component manufactured by Toshiba. It comes in a Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | TLP2630Source | TMS320F2812PGFQ | CGA4J3X7S2A105K125AE | SKHLLAA010 | RN4871U-V/RM118 | ERJT06J131V |
|---|---|---|---|---|---|---|
| Manufacturer | Toshiba | Texas Instruments | TDK | ALPS | Microchip | Panasonic |
| Package Type | Dual-In-Line Packages | Quad Flat Packages | Other | Other | Other | Resistor Chip |
| Pin Count | 8 | 176 | 2 | 4 | 17 | 2 |
| Temperature Range | ~ 70.0°C | -40.0°C ~ 125.0°C | -55.0°C ~ 125.0°C | — | -20.0°C ~ 70.0°C | -55.0°C ~ 155.0°C |
| Price | — | $10.6120 | $0.0901 | $0.1025 | $5.5000 | $0.0490 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | OBSOLETE | ACTIVE | ACTIVE | — | ACTIVE | ACTIVE |
| Electrical Parameters | ||||||
| YTEOL | 0 | 15 | 11 | — | 18 | 12 |
| Additional Feature | UL RECOGNIZED | — | — | — | — | — |
| Configuration | SEPARATE, 2 CHANNELS | — | — | — | — | — |
| Data Rate-Nom | 10 MBps | — | — | — | — | — |
| Forward Current-Max | 0.02 A | — | — | — | — | — |
| Isolation Voltage-Max | 2500 V | — | — | — | — | — |
| Mounting Feature | THROUGH HOLE MOUNT | — | SURFACE MOUNT | — | — | SURFACE MOUNT |
| Number of Elements | 2 | — | — | — | — | — |
| Number of Functions | 2 | — | — | — | — | — |
| On-State Current-Max | 0.016 A | — | — | — | — | — |
| Optoelectronic Device Type | LOGIC IC OUTPUT OPTOCOUPLER | — | — | — | — | — |
| Response Time-Max | 7.5e-8 s | — | — | — | — | — |
| Response Time-Nom | 6e-8 ns | — | — | — | — | — |
| Supply Voltage-Min | 4.5 V | 1.81 V | — | — | 1.9 V | — |
| Surface Mount | NO | YES | YES | — | NO | YES |
| Pbfree Code | — | Yes | Yes | — | — | Yes |
| Has ADC | — | YES | — | — | — | — |
| Address Bus Width | — | 19 | — | — | — | — |
| Barrel Shifter | — | NO | — | — | — | — |
| Bit Size | — | 32 | — | — | — | — |
| Boundary Scan | — | YES | — | — | — | — |
| CPU Family | — | C28X | — | — | — | — |
| Clock Frequency-Max | — | 150 MHz | — | — | — | — |
| External Data Bus Width | — | 16 | — | — | — | — |
| Format | — | FIXED POINT | — | — | — | — |
| Integrated Cache | — | NO | — | — | — | — |
| Internal Bus Architecture | — | MULTIPLE | — | — | — | — |
| JESD-30 Code | — | S-PQFP-G176 | — | — | R-XXMA-N16 | — |
| JESD-609 Code | — | e4 | e3 | — | — | e3 |
| Low Power Mode | — | YES | — | — | — | — |
| Number of External Interrupts | — | 3 | — | — | — | — |
| Number of Timers | — | 8 | — | — | — | — |
| On Chip Data RAM Width | — | 16 | — | — | — | — |
| On Chip Program ROM Width | — | 16 | — | — | — | — |
| PWM Channels | — | YES | — | — | — | — |
| Package Body Material | — | PLASTIC/EPOXY | — | — | UNSPECIFIED | — |
| Package Equivalence Code | — | QFP176,1.0SQ,20 | — | — | — | — |
| Package Shape | — | SQUARE | RECTANGULAR PACKAGE | — | RECTANGULAR | RECTANGULAR PACKAGE |
| Package Style | — | FLATPACK, LOW PROFILE, FINE PITCH | SMT | — | MICROELECTRONIC ASSEMBLY | SMT |
| Peak Reflow Temperature (Cel) | — | 260 | — | — | — | — |
| Qualification Status | — | Not Qualified | — | — | — | — |
| RAM (bytes) | — | 36864 | — | — | — | — |
| RAM (words) | — | 18432 | — | — | — | — |
| ROM Programmability | — | OTPROM | — | — | — | — |
| Screening Level | — | AEC-Q100 | — | — | TS 16949 | — |
| Supply Current-Max | — | 230 mA | — | — | — | — |
| Supply Voltage-Max | — | 2 V | — | — | 3.6 V | — |
| Supply Voltage-Nom | — | 1.9 V | — | — | 3.3 V | — |
| Technology | — | CMOS | — | — | HYBRID | METAL GLAZE/THICK FILM |
| Temperature Grade | — | AUTOMOTIVE | — | — | — | — |
| Terminal Finish | — | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) - with Nickel (Ni) barrier | — | — | MATTE TIN OVER NICKEL |
| Terminal Form | — | GULL WING | — | — | NO LEAD | — |
| Terminal Pitch | — | 0.5 mm | — | — | 1.2 mm | — |
| Terminal Position | — | QUAD | — | — | QUAD | — |
| Time@Peak Reflow Temperature-Max (s) | — | 30 | — | — | — | — |
| uPs/uCs/Peripheral ICs Type | — | DIGITAL SIGNAL PROCESSOR, OTHER | — | — | RFSOC | — |
| ## TMS320F2812PGFQ Alternates Showing results | — | Image | — | — | — | — |
| Reach Compliance Code | — | — | Compliant | — | — | Compliant |
| Capacitance | — | — | 1 µF | — | — | — |
| Capacitor Type | — | — | CERAMIC CAPACITOR | — | — | — |
| Dielectric Material | — | — | CERAMIC | — | — | — |
| Height | — | — | 1.25 mm | — | — | — |
| Multilayer | — | — | Yes | — | — | — |
| Negative Tolerance | — | — | 10% | — | — | — |
| Packing Method | — | — | TR, 7 INCH | — | — | TR, PUNCHED, 7 INCH |
| Positive Tolerance | — | — | 10% | — | — | — |
| Rated (DC) Voltage (URdc) | — | — | 100 V | — | — | — |
| Reference Standard | — | — | AEC-Q200 | — | — | AEC-Q200, IEC60115-8 |
| Size Code | — | — | 0805 | — | — | 0805 |
| Temperature Characteristics Code | — | — | X7S | — | — | — |
| Temperature Coefficient | — | — | 22% ppm/°C | — | — | 200 ppm/°C |
| Terminal Shape | — | — | WRAPAROUND | — | — | WRAPAROUND |
| Manufacturer Package Code | — | — | — | — | MODULE-17 | — |
| Factory Lead Time | — | — | — | — | 17 Weeks | — |
| Date Of Intro | — | — | — | — | 2016-04-26 | — |
| ## RN4871U-V/RM118 Alternates Showing results | — | — | — | — | Image | — |
| Construction | — | — | — | — | — | Rectangular |
| Package Height | — | — | — | — | — | 0.6 mm |
| Package Length | — | — | — | — | — | 2 mm |
| Package Width | — | — | — | — | — | 1.25 mm |
| Rated Power Dissipation (P) | — | — | — | — | — | 0.25 W |
| Rated Temperature | — | — | — | — | — | 70 °C |
| Resistance | — | — | — | — | — | 130 Ω |
| Resistor Type | — | — | — | — | — | FIXED RESISTOR |
| Tolerance | — | — | — | — | — | 5% |
| Working Voltage | — | — | — | — | — | 150 V |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 5 alternatives for TLP2630 — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for TLP2630 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TLP2630 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
Can't Find What You Need?
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FAQ
What is equivalent to TLP2630?
Known equivalents for TLP2630 include TMS320F2812PGFQ, CGA4J3X7S2A105K125AE, SKHLLAA010. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TLP2630?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TLP2630 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.