TLK4201EARGTT Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
TLK4201EARGTT is a high-speed digital link interface IC from Texas Instruments supporting data rates up to 4.25Gbps in a compact 16-pin VQFN (3x3mm) package. It provides reliable high-speed serial data transmission with integrated signal conditioning. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- TLK4201EARGTT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-high data rate up to 4.25Gbps enabling gigabit serial communication in compact embedded systems
- 16-pin VQFN 3x3mm package with heat sink slug for excellent thermal performance in space-constrained designs
- RoHS-compliant lead-free construction with JEDEC-standard plastic/epoxy chip carrier package
Applications
The TLK4201EARGTT is designed for high-speed serial data link applications including backplane interconnects, storage systems, and networking equipment requiring reliable gigabit data transmission. Its compact VQFN package and integrated signal conditioning make it ideal for line cards, FPGA interface boards, and high-density communication modules. The device is also used in test and measurement equipment and industrial networking systems where high-bandwidth serial links are essential.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Data Rate | 4250000Mbps |
| JESD-30 Code | S-PQCC-N16 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC16,.12SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 0.038mA |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the maximum data rate of the TLK4201EARGTT?
The TLK4201EARGTT supports data rates up to 4.25Gbps, making it suitable for high-speed serial communication in storage, networking, and backplane applications. This high data rate enables efficient gigabit data transfer between FPGAs, processors, and communication controllers.
What package does the TLK4201EARGTT use?
The TLK4201EARGTT is housed in a 16-pin VQFN (Very thin profile Quad Flat No-Lead) package measuring 3x3mm with an integrated heat sink slug. This compact, leadless package supports high-density PCB designs and provides good thermal dissipation for high-speed operation.
Is the TLK4201EARGTT RoHS compliant?
Yes, the TLK4201EARGTT is lead-free and RoHS compliant, as indicated by its Pb-free code and JESD-609 e4 classification. The plastic/epoxy chip carrier package supports a peak reflow temperature compatible with modern lead-free assembly processes.
What are typical applications for the TLK4201EARGTT?
Typical applications include high-speed serial backplane interfaces, storage area network (SAN) equipment, FPGA-to-FPGA communication links, and networking line cards. The 4.25Gbps data rate supports protocols such as Fibre Channel and XAUI, making it versatile for enterprise and industrial networking designs.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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