TLK10081CTR Texas Instruments Integrated Circuit (BGA) In Stock
TLK10081CTR is a 10-Gbps 1-to-8 channel multi-rate redundant link aggregator IC by Texas Instruments in a 144-pin BGA package. Key specs: up to 10,000,000 Mbps data rate, 8 channels, 260°C peak reflow compatible. From competitive pricing, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 144
- Lifecycle
- ACTIVE
- Datasheet
- TLK10081CTR Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $24.5177(MOQ 7)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLK10081CTR?
- 10 Gbps per-channel multi-rate operation enables flexible high-speed serial link aggregation across diverse network topologies
- 1-to-8 channel architecture with redundancy support improves system reliability in mission-critical networking and telecom equipment
- 144-pin BGA package with thermal slug provides robust thermal management for sustained high-speed data transmission
What is TLK10081CTR used for?
TLK10081CTR is designed for high-density networking line cards, telecom switching fabrics, and data center interconnect systems where multiple 10 Gbps serial links must be aggregated and made redundant. The 1-to-8 channel architecture allows a single IC to manage link failover and aggregation, reducing component count in enterprise routers, optical transport nodes, and SONET/SDH framing equipment. Its 260°C peak reflow compatibility ensures robust solderability in high-reliability PCB assembly processes.
What are the specifications of TLK10081CTR?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Data Rate | 10000000Mbps |
| JESD-30 Code | S-PBGA-B144 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Where can I find the TLK10081CTR datasheet?
TLK10081CTR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLK10081CTR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What maximum data rate does TLK10081CTR support per channel in a serial link aggregation design?
TLK10081CTR supports a maximum data rate of 10 Gbps per channel in a multi-rate configuration. With 8 channels, the device can aggregate up to 80 Gbps of total throughput in parallel link configurations, making it suitable for high-capacity backplane interconnects in 10GbE switches, OTN transport equipment, and SONET/SDH line cards requiring dense serial link management.
How does TLK10081CTR's redundant link aggregation feature improve reliability in telecom equipment?
TLK10081CTR implements 1-to-8 channel redundancy, allowing one active link to automatically switch over to a standby channel upon fault detection. This hardware-level failover reduces downtime to sub-millisecond recovery intervals, which is critical in carrier-grade telecom equipment with 99.999% availability requirements. The redundancy eliminates the need for external switch ICs, reducing board complexity and latency in protection switching designs.
What package does TLK10081CTR use and how does the 144-pin BGA affect PCB design for high-speed signal integrity?
TLK10081CTR is housed in a 144-pin plastic BGA package with a heat-sink slug for thermal dissipation. High-speed 10 Gbps BGA designs require controlled-impedance PCB traces of 50 ohm or 100 ohm differential, with via stubs minimized through back-drilling. The BGA footprint requires a 6-layer or higher PCB stackup with ground planes adjacent to signal layers to maintain signal integrity at 10 Gbps edge rates.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 7+ | $43.7000 | $305.90 |
| 25+ | $26.6365 | $665.91 |
| 50+ | $25.4258 | $1271.29 |
| 100+ | $24.5177 | $2451.77 |
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