TLE2144CDWG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TEXAS INSTRUMENTS - TLE2144CDWG4 - Operational Amplifier, Quad, 4 Amplifier, 5.9 MHz, 45 V/?s, ? 2V to ? 22V, WSOIC, 16 Pins
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- TLE2144CDWG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLE2144CDWG4?
- Integrated Circuit from Texas Instruments for production electronic assemblies
- Small Outline Packages package with 16 pins for PCB footprint planning
- Datasheet context includes 4 A for engineering cross-checks
- Manufacturer or distributor datasheet URL available for technical verification
- Suitable for embedded systems, industrial electronics, communication equipment applications
What is TLE2144CDWG4 used for?
TLE2144CDWG4 is commonly used in embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing where designers need dependable integrated circuit behavior and manufacturer-traceable sourcing. It is appropriate for production BOM builds, repair demand, and alternate qualification workflows that compare package fit, lifecycle status, and parameters such as 16 pins.
What are the specifications of TLE2144CDWG4?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 1.6 µA |
| Bias Current-Max (IIB) @25C | 2 µA |
| Common-mode Reject Ratio-Min | 80dB |
| Common-mode Reject Ratio-Nom | 108dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 3200 µV |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | NO |
| Neg Supply Voltage Limit-Max | -22 V |
| Neg Supply Voltage-Nom (Vsup) | -15 V |
| Number of Functions | 4 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.4 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Min | 27V/us |
| Slew Rate-Nom | 45V/us |
| Supply Current-Max | 18.8mA |
| Supply Voltage Limit-Max | 22V |
| Supply Voltage-Nom (Vsup) | 15V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 6000 |
| Voltage Gain-Min | 75000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TLE2144CDWG4 datasheet?
TLE2144CDWG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLE2144CDWG4?
Compatible alternatives and drop-in replacements for TLE2144CDWG4:
Frequently Asked Questions
Which design use cases are a practical fit for TLE2144CDWG4?
TLE2144CDWG4 is a Integrated Circuit from Texas Instruments suited to embedded systems, industrial electronics, communication equipment, test fixtures, and production BOM sourcing. The 16 pins detail helps engineers confirm schematic fit, interface allocation, and sourcing suitability before BOM approval.
How should engineers check package compatibility for TLE2144CDWG4 during layout review?
Use the Small Outline Packages package information together with 16 pins when comparing footprints, assembly drawings, and mating or socket constraints. This reduces layout risk before prototype or production purchasing.
What should procurement keep aligned when cross-referencing TLE2144CDWG4 against alternates?
Cross-reference checks should preserve the manufacturer, Integrated Circuit function, package style, lifecycle status, and at least one key parameter such as 4 A. Matching these details lowers substitution risk across 1 approved BOM.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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