TLE2021BMJGB Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
TLE2021BMJGB is a precision single operational amplifier with low input offset and frequency compensation by Texas Instruments, in a ceramic DIP (JG) package. Key specs: 85 dB min CMRR, 0.09 µA max bias current, voltage-feedback architecture, military-grade ceramic package. From $8.50, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TLE2021BMJGB Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 85 dB minimum CMRR (110 dB typical) for excellent rejection of common-mode noise in precision analog circuits
- Ultra-low 0.09 µA max input bias current minimizes errors when interfacing high-impedance sources
- Internal frequency compensation for stable unity-gain operation without external components
- Ceramic hermetic DIP (JG) package provides high reliability for military and aerospace applications
- Low 6 nA max input offset current reduces differential errors in bridge and instrumentation circuits
Applications
TLE2021BMJGB is suited for precision instrumentation amplifiers, data acquisition front ends, and military/aerospace analog signal conditioning where long-term stability and low noise are paramount. Its ceramic hermetic package meets the reliability requirements of harsh-environment systems operating over extended temperature ranges beyond -55°C to 125°C. The low input bias current and high CMRR make it an excellent choice for driving ADCs in seismic sensors, strain gauge bridges, and precision voltage references.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.09 µA |
| Bias Current-Max (IIB) @25C | 0.07 µA |
| Common-mode Reject Ratio-Min | 85dB |
| Common-mode Reject Ratio-Nom | 110dB |
| Frequency Compensation | YES |
| Input Offset Current-Max (IIO) | 0.006 µA |
| Input Offset Voltage-Max | 200 µV |
| JESD-30 Code | R-GDIP-T8 |
| JESD-609 Code | e0 |
| Low-Bias | NO |
| Low-Offset | YES |
| Micropower | YES |
| Neg Supply Voltage Limit-Max | -20 V |
| Neg Supply Voltage-Nom (Vsup) | -15 V |
| Number of Functions | 1 |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP8,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Packing Method | TUBE |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Slew Rate-Min | 0.6V/us |
| Slew Rate-Nom | 0.5V/us |
| Subcategory | Operational Amplifier |
| Supply Current-Max | 0.3mA |
| Supply Voltage Limit-Max | 20V |
| Supply Voltage-Nom (Vsup) | 15V |
| Surface Mount | NO |
| Technology | BIPOLAR |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 1700 |
| Voltage Gain-Min | 300000 |
| Wideband | NO |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the input bias current specification of TLE2021BMJGB and how does it affect high-impedance sensor circuits?
TLE2021BMJGB has a maximum input bias current of 0.09 µA (90 nA) at 25°C, with a typical value of 0.07 µA. When connected to a 1 MΩ source impedance, this bias current creates at most a 90 mV offset error at the input, which can be reduced below 1 mV by using matched source resistors on both inputs, making it suitable for high-impedance bridge and thermocouple sensor interfaces.
For a military avionics data acquisition system, why choose TLE2021BMJGB over a commercial-grade op-amp?
TLE2021BMJGB uses a ceramic hermetic DIP (JG) package that withstands moisture, shock, and vibration per MIL-spec qualification, unlike plastic-packaged commercial op-amps. Its 85 dB minimum CMRR ensures consistent noise rejection across the full military temperature range, and the hermetic seal prevents delamination or parameter drift in high-altitude or humidity-cycled avionics environments where commercial SOIC parts may fail prematurely.
How does the frequency compensation of TLE2021BMJGB benefit precision DC circuit designs?
TLE2021BMJGB includes internal frequency compensation that ensures unity-gain stability without any external capacitors, simplifying PCB design. The compensation rolls off the open-loop gain smoothly, providing a phase margin of at least 45 degrees at the unity-gain crossover frequency, which prevents oscillation in closed-loop configurations such as voltage followers, difference amplifiers, and integrator circuits operating at DC to low-kHz bandwidths.
What package does TLE2021BMJGB use and how does it compare in size to a plastic SOIC?
TLE2021BMJGB comes in an 8-pin ceramic DIP (JG) package with 2.54 mm lead pitch and a body approximately 9.8 mm x 6.6 mm, which is larger than a standard 8-pin SOIC (4.9 mm x 3.9 mm). The ceramic hermetic construction justifies this larger footprint for military and high-reliability boards where the ceramic seal is required to prevent hermeticity failures over a -55°C to 125°C temperature range.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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