TLC27M9IDG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments TLC27M9IDG4 is a integrated circuit for embedded electronics, industrial controls, instrumentation, and production BOM sourcing. It offers 14 pins, 520 kHz, 5 V in Small Outline Packages. From quote-based sourcing, buyers can request stock checks and worldwide shipping support.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 14
- Lifecycle
- OBSOLETE
- Datasheet
- TLC27M9IDG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLC27M9IDG4?
- 14 pins, 520 kHz, 5 V documented for BOM matching and engineering review
- Small Outline Packages format supports board-level integration and purchasing checks
- Texas Instruments TLC27M9IDG4 ordering identity helps buyers match approved vendor lists
- Suitable for embedded electronics, industrial controls, instrumentation, and production BOM sourcing where repeatable component sourcing matters
What is TLC27M9IDG4 used for?
TLC27M9IDG4 is commonly used in embedded electronics, industrial controls, instrumentation, and production BOM sourcing, especially when buyers need a traceable Texas Instruments part for production or maintenance builds. It fits engineering teams that compare datasheet limits, package fit, lifecycle status, and sourcing availability before releasing a BOM.
What are the specifications of TLC27M9IDG4?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.002 µA |
| Common-mode Reject Ratio-Min | 65dB |
| Common-mode Reject Ratio-Nom | 91dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 2000 µV |
| JESD-30 Code | R-PDSO-G14 |
| JESD-609 Code | e4 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | YES |
| Number of Functions | 4 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP14,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | YES |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 0.43V/us |
| Supply Current-Max | 1.8mA |
| Supply Voltage Limit-Max | 18V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 525 |
| Voltage Gain-Min | 25000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TLC27M9IDG4 datasheet?
TLC27M9IDG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLC27M9IDG4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which design requirement does TLC27M9IDG4 usually cover?
TLC27M9IDG4 is selected as a integrated circuit for embedded electronics, industrial controls, instrumentation, and production BOM sourcing. The available data lists 14 pins, giving engineers a concrete value to compare before approving the BOM line.
How should buyers check package fit for TLC27M9IDG4?
Buyers should compare the Small Outline Packages listing, datasheet footprint, and assembly constraints. The current part record includes 14 pins, which helps confirm mechanical or electrical fit.
When is TLC27M9IDG4 a practical sourcing candidate?
TLC27M9IDG4 is practical when the BOM calls for a Texas Instruments component with 14 pins and the purchasing team needs stock checks, traceability, and worldwide shipping support.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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