TLC272BCDG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TEXAS INSTRUMENTS - TLC272BCDG4 - Operational Amplifier, Dual, 2 Amplifier, 1.7 MHz, 3.6 V/µs, 3V to 16V, SOIC, 8 Pins
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- TLC272BCDG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TLC272BCDG4?
- Integrated Circuit from Texas Instruments identified by manufacturer part number TLC272BCDG4
- Documented technical context includes 2 A for engineering comparison
- Package or mechanical reference recorded as Small Outline Packages for footprint checks
- Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
- Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval
What is TLC272BCDG4 used for?
TLC272BCDG4 is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 2 A.
What are the specifications of TLC272BCDG4?
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.00006 µA |
| Bias Current-Max (IIB) @25C | 0.00006 µA |
| Common-mode Reject Ratio-Min | 65dB |
| Common-mode Reject Ratio-Nom | 80dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 3000 µV |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Low-Bias | YES |
| Low-Offset | NO |
| Micropower | NO |
| Number of Functions | 2 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TUBE |
| Peak Reflow Temperature (Cel) | 260 |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 2.9V/us |
| Supply Current-Max | 4.4mA |
| Supply Voltage Limit-Max | 18V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Unity Gain BW-Nom | 1700 |
| Voltage Gain-Min | 10000 |
| Wideband | NO |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the TLC272BCDG4 datasheet?
TLC272BCDG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TLC272BCDG4?
Compatible alternatives and drop-in replacements for TLC272BCDG4:
Frequently Asked Questions
Which design checks should buyers confirm before selecting TLC272BCDG4?
Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 2 A, which should be matched against the target circuit and sourcing documentation.
How does the recorded package information affect sourcing TLC272BCDG4?
The recorded package reference is Small Outline Packages, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 2 A in the engineering review so procurement does not substitute a part with mismatched limits.
When comparing alternates for TLC272BCDG4, which parameters matter most?
Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 2 A, any alternate should match that requirement before release.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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