TL851CDG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TL851CDG4 is a sonar ranging control IC from Texas Instruments housed in a 16-pin SOIC package. It provides single-function ultrasonic distance measurement control with 260°C peak reflow compatibility for reliable SMT assembly.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- TL851CDG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 40.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TL851CDG4?
- Single-function sonar ranging control IC simplifies ultrasonic distance measurement circuit design with minimal external components
- 16-pin SOIC package with 0.25-inch pitch enables compact PCB footprint for space-constrained proximity sensing boards
- Plastic/epoxy small outline package supports 260°C peak reflow temperature for standard SMT manufacturing processes
What is TL851CDG4 used for?
TL851CDG4 is suited for ultrasonic proximity detection and distance measurement systems in robotics, industrial automation, and consumer electronics. Its single-function sonar ranging control makes it a straightforward solution for obstacle avoidance modules and liquid level sensing equipment. The 16-pin SOIC form factor integrates easily into compact sensor boards requiring reliable non-contact distance measurement.
What are the specifications of TL851CDG4?
| YTEOL | 0 |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 0.26mA |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.01 |
Where can I find the TL851CDG4 datasheet?
TL851CDG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for TL851CDG4?
Compatible alternatives and drop-in replacements for TL851CDG4:
Frequently Asked Questions
What package does TL851CDG4 use and how many pins does it have for interfacing?
TL851CDG4 is packaged in a 16-pin SOIC (Small Outline Integrated Circuit) with a 0.25-inch pin pitch. The 16-pin count provides adequate signal and power connections for sonar ranging control, and the SOIC outline supports standard pick-and-place SMT assembly with a 260°C peak reflow temperature.
In which sensing applications is TL851CDG4 most commonly used for distance measurement?
TL851CDG4 is primarily used in ultrasonic sonar ranging systems for proximity detection and non-contact distance measurement. Typical applications include industrial obstacle detection at ranges up to several meters, liquid level sensing in tanks, and robotics navigation, all requiring accurate echo-time measurement with minimal discrete component count.
What peak reflow temperature does TL851CDG4 support during PCB soldering and does it comply with lead-free standards?
TL851CDG4 supports a 260°C peak reflow temperature, consistent with standard lead-free SMT soldering profiles. Its JESD-609 Code e4 designation confirms RoHS-compliant, lead-free construction, making it suitable for designs requiring halogen-free and Pb-free assembly processes in consumer and industrial electronics.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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