THS3111DGNR Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
THS3111DGNR is a single-channel, low-noise, high-voltage current-feedback operational amplifier from Texas Instruments in an 8-pin MSOP PowerPAD package. It provides a wide gain-bandwidth product, 60 dB minimum CMRR, and operates over -40 °C to +85 °C. Available from authorized distributors with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- THS3111DGNR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of THS3111DGNR?
- Current-feedback architecture delivers flat, gain-independent bandwidth, enabling stable amplification at gains of 2 V/V to 10 V/V across video and IF signal chains without significant peaking
- Low-noise input stage with maximum input bias current of 10 µA and maximum input offset voltage of 12 mV suits precision signal conditioning in communications and test equipment
- 8-pin MSOP PowerPAD package provides an exposed thermal pad that reduces junction-to-board thermal resistance, supporting continuous high-output-current operation without external heatsinking
- 60 dB minimum common-mode rejection ratio (CMRR) with 68 dB typical value suppresses common-mode noise in differential analog signal paths and single-ended-to-differential conversion stages
- Integrated frequency compensation eliminates the need for external phase-margin capacitors, reducing external component count and simplifying PCB layout around the amplifier
What is THS3111DGNR used for?
THS3111DGNR is used in high-speed analog signal chains for cable TV distribution amplifiers, video line drivers, and ADSL/VDSL line interface circuits where current-feedback topology delivers consistent bandwidth from DC to hundreds of megahertz across varying closed-loop gain settings. Its low-noise, high-voltage output swing capability makes it suitable for driving back-terminated coaxial cables and high-impedance ADC inputs in test and measurement instruments operating across the industrial temperature range of -40 °C to +85 °C. The PowerPAD MSOP package is favored in compact handheld instruments and point-of-load amplifier modules where board space is limited and thermal management is critical.
What are the specifications of THS3111DGNR?
| Pbfree Code | No |
| YTEOL | 0 |
| Amplifier Type | OPERATIONAL AMPLIFIER |
| Architecture | CURRENT-FEEDBACK |
| Average Bias Current-Max (IIB) | 10 µA |
| Bias Current-Max (IIB) @25C | 8 µA |
| Common-mode Reject Ratio-Min | 60dB |
| Common-mode Reject Ratio-Nom | 68dB |
| Frequency Compensation | YES |
| Input Offset Voltage-Max | 12000 µV |
| JESD-30 Code | S-PDSO-G8 |
| Low-Bias | NO |
| Low-Offset | NO |
| Micropower | NO |
| Neg Supply Voltage-Nom (Vsup) | -5 V |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Power | NO |
| Programmable Power | NO |
| Qualification Status | Not Qualified |
| Slew Rate-Nom | 1300V/us |
| Supply Current-Max | 7.5mA |
| Supply Voltage Limit-Max | 33V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Unity Gain BW-Nom | 100000 |
| Wideband | YES |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Where can I find the THS3111DGNR datasheet?
THS3111DGNR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for THS3111DGNR?
Compatible alternatives and drop-in replacements for THS3111DGNR:
Frequently Asked Questions
What advantage does the current-feedback architecture of THS3111DGNR provide over voltage-feedback amplifiers in wideband gain stages?
Current-feedback amplifiers such as THS3111DGNR maintain nearly constant bandwidth regardless of the closed-loop gain setting, unlike voltage-feedback op-amps whose gain-bandwidth product stays fixed. For example, THS3111DGNR can sustain useful small-signal bandwidth of several hundred MHz at a gain of 5 V/V, while a voltage-feedback amplifier with the same unity-gain bandwidth would drop to less than a fifth of that — making THS3111DGNR preferable for cable driver and video distribution designs requiring flat response from 1 MHz to over 100 MHz.
How does the 60 dB CMRR specification of THS3111DGNR affect performance in single-ended-to-differential conversion circuits?
A minimum CMRR of 60 dB (68 dB typical) means THS3111DGNR attenuates common-mode interference at its inputs by a factor of at least 1000:1, converting a 100 mV common-mode noise voltage to no more than 100 µV of differential error at the output. In differential ADC driver stages operating at signal amplitudes of 1 V peak-to-peak, this keeps common-mode-induced offset well below 0.01 % of full scale, preserving 12-bit to 14-bit ADC linearity without additional common-mode filtering.
For a 75 Ω coaxial cable driving application, how should THS3111DGNR be configured to maintain flat frequency response?
To drive a 75 Ω back-terminated coaxial cable, THS3111DGNR should be configured with a 75 Ω series output resistor and a 75 Ω load at the far end, resulting in a total load of 150 Ω seen by the amplifier output. The gain resistors should be set to a closed-loop gain of 2 V/V to compensate for the 6 dB voltage divider loss of the back-termination network, and the feedback resistor value should follow the datasheet recommended range of 560 Ω to 1 kΩ to maintain the optimum noise gain and phase margin for a flat ±0.1 dB passband through at least 50 MHz.
What thermal benefit does the PowerPAD exposed die-attach pad provide for THS3111DGNR in a compact PCB design?
The exposed PowerPAD on THS3111DGNR's MSOP-8 package conducts heat directly from the die to a PCB copper pour, reducing junction-to-board thermal resistance to approximately 35 °C/W compared to roughly 100 °C/W for a standard MSOP without a thermal pad. At a quiescent supply current of 15 mA and ±15 V rails, quiescent dissipation is about 450 mW; with the PowerPAD soldered to a 1 inch² copper pour, the junction temperature rise above a 25 °C ambient is only about 16 °C, keeping the device well within its -40 °C to +85 °C operating range.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit