TFML-110-01-S-D-RA SAMTEC Connector (Other) In Stock
SAMTEC TFML-110-01-S-D-RA is a 10-position, dual-row right-angle board receptacle connector with 30 µin gold over 50 µin nickel contacts. Measuring 0.625 x 0.225 x 0.29 inch, it provides RoHS-compliant, low-profile right-angle mating for PCB-to-PCB or FMC module interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TFML-110-01-S-D-RA Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position dual-row right-angle (RA) receptacle with 30 µin gold over 50 µin nickel contact finish for low-resistance, high-cycle mating
- Compact 0.625 x 0.225 x 0.29 inch body enables right-angle board-to-board connections in space-constrained enclosures
- RoHS-compliant (lead-free) construction with 1-week factory lead time, suitable for fast-turn prototypes and production builds
Applications
The TFML-110-01-S-D-RA is used in FPGA mezzanine card (FMC) assemblies, embedded computing daughter cards, and modular instrument platforms that require compact dual-row right-angle receptacles for reliable board-to-board interconnects. Its 30 µin gold contact finish supports repeated mating cycles without significant degradation, making it suitable for test and measurement equipment with frequent module swaps. The right-angle orientation also allows edge-access wiring in tight-pitch rack-mount systems where vertical connectors would conflict with adjacent boards.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.65 |
| Additional Feature | ROHS COMPLIANT |
| Body Breadth | 0.225inch |
| Body Depth | 0.29inch |
| Body Length | 0.625inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 5A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 22 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TFML-110-01-S-D-RA use, and how many mating cycles does it support?
The TFML-110-01-S-D-RA uses 30 µin gold over 50 µin nickel on the mating surfaces, which provides excellent oxidation resistance and maintains low contact resistance across multiple mating cycles. This gold thickness is typically rated for hundreds of mating cycles in FMC and modular instrumentation assemblies where the connector may be removed and reinserted during system development or field service.
How does the right-angle orientation of the TFML-110-01-S-D-RA benefit FPGA mezzanine card layouts?
The right-angle (RA) orientation directs the mating axis parallel to the PCB surface rather than perpendicular to it, allowing the mating connector to be inserted from the board edge. In FPGA mezzanine card designs with limited vertical clearance between the carrier and mezzanine, this prevents stack-height conflicts and enables a 10-position dual-row interconnect within a 0.625-inch body length.
What is the lead time for the TFML-110-01-S-D-RA, and is it appropriate for both prototype and production quantities?
The TFML-110-01-S-D-RA carries a 1-week factory lead time from SAMTEC, which is faster than many specialty connectors that require 4 to 12 weeks. This short lead time, combined with RoHS compliance and a standard 10-position dual-row form factor, makes it practical for both fast-turn prototype builds and scheduled production runs without long-term buffer stock commitments.
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