TFM-148-22-STL-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-148-22-STL-D-A-P-TR is a 96-position dual-row high-reliability Tiger Eye terminal strip with 0.050-inch pitch, surface-mount low-profile body, and tape-and-reel packaging. Its gold-plated contacts support high-cycle mating in dense board-to-board and signal distribution applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-148-22-STL-D-A-P-TR?
- 96-position dual-row configuration at 0.050-inch (1.27mm) pitch for ultra-high-density signal interconnect on constrained PCBs
- Surface-mount low-profile (STL) body minimizes stack height in multi-board assemblies and compact embedded modules
- Tape-and-reel (TR) packaging supports automated pick-and-place assembly for high-volume production lines
What is TFM-148-22-STL-D-A-P-TR used for?
The TFM-148-22-STL-D-A-P-TR serves high-density board-to-board and mezzanine interconnect applications in telecommunications line cards, FPGA prototyping platforms, and high-speed data acquisition systems. Its 96-position dual-row layout at 0.050-inch pitch delivers 48 signals per row in a surface-mount footprint, reducing PCB area compared to 0.100-inch alternatives. Tape-and-reel packaging enables seamless integration into automated SMT assembly lines for volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-148-22-STL-D-A-P-TR datasheet?
TFM-148-22-STL-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-148-22-STL-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact count and pitch of TFM-148-22-STL-D-A-P-TR for mezzanine board designs?
The TFM-148-22-STL-D-A-P-TR provides 96 total contacts arranged in 2 rows of 48 at a 0.050-inch (1.27mm) pitch. This high density allows a mezzanine interface to route up to 96 signals across a footprint of approximately 60mm length, making it competitive with higher-pitch alternatives that would require significantly more board real estate.
How does the STL low-profile body of TFM-148-22-STL-D-A-P-TR benefit stacked board assemblies?
The STL (surface-mount low-profile) body reduces the above-board height to minimize the stack clearance required between mated PCBs. In multi-board systems with 4mm or less inter-board spacing, the low-profile design maintains mechanical clearance while supporting 96 signal paths at 0.050-inch pitch, enabling compact enclosure designs for embedded computing and telecom modules.
When should an engineer choose tape-and-reel (TR) packaging for TFM-148-22-STL-D-A-P-TR in production?
Tape-and-reel packaging is preferred when production volumes exceed approximately 500 units per run and automated SMT pick-and-place equipment is available. The TR format feeds connectors at consistent 4mm carrier pitch intervals, reducing placement errors versus manual loading and enabling throughput of hundreds of boards per hour on standard reflow lines for the 96-position, 0.050-inch pitch TFM connector.
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About SAMTEC
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