TFM-148-03-F-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-148-03-F-D-LC is a SEARAY high-speed board-to-board array connector. It provides 96 positions on a .050 in pitch open-pin-field terminal. From inquiry pricing, request current stock for worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- TFM-148-03-F-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-148-03-F-D-LC?
- 96-position SEARAY open-pin-field array terminal for dense board-to-board interconnects
- .050 in pitch contact layout supports compact high-speed mezzanine and stacking designs
- production ordering configuration supports production purchasing and automated assembly planning
- SAMTEC connector family with datasheet-backed SEAM mechanical configuration
What is TFM-148-03-F-D-LC used for?
This connector is used in compact mezzanine, communications, test, and embedded control boards that need dense board-to-board signal routing. It fits production builds where 96 positions, a .050 in pitch, and production ordering configuration help simplify high-density PCB assembly.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-148-03-F-D-LC datasheet?
TFM-148-03-F-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-148-03-F-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What signal density does TFM-148-03-F-D-LC provide compared to standard 0.100" connectors?
TFM-148-03-F-D-LC delivers 96 pins at a 0.050" (1.27 mm) pitch in a dual-row female configuration, achieving twice the signal density of traditional 0.100" pitch connectors. This high-density footprint enables routing of 96 independent signals across a markedly smaller PCB footprint, ideal for compact mezzanine and board-to-board interconnect applications.
Which high-speed digital interfaces benefit from using TFM-148-03-F-D-LC as the board-to-board connector?
TFM-148-03-F-D-LC suits high-speed digital interfaces in servers, FPGA development boards, and networking line cards where 96 pins at 0.050" pitch provide ample signal capacity for PCIe, DDR, and SerDes differential pairs. The open-pin-field array layout supports flexible signal assignment, enabling custom routing of high-bandwidth data buses at multi-Gbps rates.
How does TFM-148-03-F-D-LC integrate into automated SMT assembly processes?
TFM-148-03-F-D-LC features a surface mount footprint compatible with lead-free SMT reflow soldering at up to 260°C per JEDEC J-STD-020. Its 96-pin, 0.050" pitch dual-row layout is designed for automated pick-and-place equipment, enabling consistent solder joint quality in high-volume PCB production for server, telecom, and industrial mezzanine card assemblies.
What mating connector family is compatible with TFM-148-03-F-D-LC for board-to-board stacking?
TFM-148-03-F-D-LC mates with SAMTEC's compatible pin-strip counterparts in the TFM/TSM SEARAY family, enabling precise board-to-board stacking with 96 pins at 0.050" pitch. The -03 height designation controls the stacking distance between mated boards, making it suitable for mezzanine card and module systems requiring controlled inter-board separation in servers and industrial controllers.
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