TFM-148-01-FM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-148-01-FM-D-LC is a 96-position dual-row high-reliability Tiger Eye terminal strip with 1.27 mm (0.050") pitch, featuring low-clearance design for compact mezzanine board stacking. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- TFM-148-01-FM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-148-01-FM-D-LC?
- 96 positions in dual-row 1.27 mm (0.050 inch) pitch Tiger Eye design for ultra-high-density board-to-board signal routing
- Low-clearance (LC) profile minimizes board stacking height to under 5 mm enabling compact multi-board assemblies
- High-reliability Tiger Eye contact geometry ensures consistent mating force and low contact resistance below 20 mΩ over 30+ mating cycles
What is TFM-148-01-FM-D-LC used for?
TFM-148-01-FM-D-LC is designed for high-reliability mezzanine card interconnects in defense electronics, aerospace avionics, and industrial computing systems where 96 signal connections must be routed through a minimal board footprint. The Tiger Eye contact geometry provides secure wiping action that maintains reliable electrical continuity even after vibration and thermal cycling across -55°C to +125°C temperature ranges. Its low-clearance profile enables multi-layer board stacks with inter-board spacing below 5 mm in size-constrained embedded computing modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-148-01-FM-D-LC datasheet?
TFM-148-01-FM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-148-01-FM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does TFM-148-01-FM-D-LC provide and how are they distributed across the dual-row layout?
TFM-148-01-FM-D-LC provides 96 signal positions arranged in a dual-row configuration with 48 contacts per row on a 1.27 mm (0.050 inch) pitch. The total connector body length spans approximately 61 mm for the 48-position rows, allowing routing of parallel bus interfaces such as 64-bit data buses with address and control signals on a single connector footprint in mezzanine computing and FPGA daughterboard designs.
What does the Tiger Eye contact geometry mean for long-term reliability in harsh industrial environments?
The Tiger Eye contact design used in TFM-148-01-FM-D-LC features a spring beam geometry that generates consistent normal force across all 96 positions during mating, maintaining contact resistance below 20 mΩ even after 30 mating cycles and thermal cycling from -55°C to +125°C. The wiping action during insertion self-cleans oxidation from gold-plated contact surfaces, which is critical in industrial environments where connector contacts may be exposed to airborne contaminants during field installation of plug-in module cards.
What board stacking height does the low-clearance (LC) version enable compared to standard TFM configurations?
The low-clearance (LC) suffix on TFM-148-01-FM-D-LC reduces the connector standoff height, enabling board stacking heights of approximately 4 mm to 6 mm between mated PCBs, compared to 8 mm to 12 mm for standard TFM configurations with taller insulator profiles. This 4 mm to 6 mm stack height is essential for slim form-factor embedded computing enclosures such as VITA 62 power supply modules, 3U VPX cards, and compact PCIe mezzanine modules where vertical envelope is strictly limited.
Which connector family should TFM-148-01-FM-D-LC mate with for a completed board-to-board assembly?
TFM-148-01-FM-D-LC mates with SAMTEC SFM series 1.27 mm pitch dual-row socket strips in the 96-position configuration, such as SFM-148 series parts. The matched TFM header and SFM socket pair provides a fully rated board-to-board mezzanine assembly with defined insertion force below 50 N for the 96-position configuration, and extraction force above 20 N ensuring boards cannot separate under vibration loads specified in MIL-STD-810 Method 514 for ground vehicle and shipboard applications.
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