TFM-147-13-LM-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-147-13-LM-D is a 94-position dual-row high-reliability Tiger Eye terminal strip at 1.27 mm (0.050 inch) pitch with low mated height and surface mount termination. Features gold-plated Tiger Eye contacts rated at 1 A per pin and 150 V working voltage for dense mezzanine card pin-strip connections. Available from stock worldwide with same-day shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TFM-147-13-LM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-147-13-LM-D?
- 94-position dual-row Tiger Eye terminal strip at 1.27 mm (0.050 inch) pitch with LM (low mated height) profile for compact board stacking in aerospace and military electronics
- Gold-plated Tiger Eye dual-beam contacts rated 1 A per pin and 150 V working voltage with self-wiping action for low contact resistance across multiple mating cycles
- High-reliability SMT construction rated -55 °C to +125 °C, compatible with automated reflow soldering at 260 °C and lead-free assembly processes
What is TFM-147-13-LM-D used for?
The TFM-147-13-LM-D is designed as a pin-strip mating half for high-density mezzanine card interconnects in defense avionics, radar processing modules, and FPGA-based embedded computing boards requiring 94 pins at 1.27 mm pitch. Its low mated height (LM) profile minimizes the inter-board gap, enabling tighter board stacking in space-constrained military and aerospace chassis assemblies. The Tiger Eye contact design provides reliable electrical connections across the rated -55 °C to +125 °C temperature range for mission-critical signal and power distribution applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-147-13-LM-D datasheet?
TFM-147-13-LM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-147-13-LM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the LM designation specify for the TFM-147-13-LM-D terminal strip?
The LM (low mated height) designation in the TFM-147-13-LM-D specifies a reduced inter-board clearance profile when mated with a corresponding socket strip. The low mated height design reduces board-to-board separation to approximately 3 mm to 5 mm, enabling tight stacking in compact aerospace or military chassis with 94-position 1.27 mm pitch dual-row interconnects rated at 1 A per pin.
How does the Tiger Eye contact technology in the TFM-147-13-LM-D benefit high-cycle mating applications?
Tiger Eye contacts in the TFM-147-13-LM-D employ a dual-beam wiping action during mating that removes surface oxides and maintains contact resistance below 20 milliohms across the rated insertion cycles. This self-cleaning mechanism is critical for field-replaceable mezzanine cards that are inserted and removed dozens of times in defense and industrial computing platforms operating from -55 °C to +125 °C.
Which board-to-board mezzanine standards is the TFM-147-13-LM-D compatible with?
The TFM-147-13-LM-D is compatible with XMC (VITA 42), FMC (VITA 57.1), and AMC mezzanine standards that use 1.27 mm pitch dual-row pin strips. Its 94-position layout at 1 A per pin and 150 V working voltage supports signal, clock distribution, and auxiliary power delivery across FPGA mezzanine and processor card interfaces in embedded computing systems rated for -55 °C to +125 °C.
What is the pin count and pitch of the TFM-147-13-LM-D and how does it compare to standard 2.54 mm pitch terminal strips?
The TFM-147-13-LM-D provides 94 pins in a dual-row configuration at 1.27 mm (0.050 inch) pitch, which is exactly half the spacing of standard 2.54 mm (0.100 inch) pitch terminal strips. This finer 1.27 mm pitch halves the connector footprint area, enabling twice the pin density per PCB length — critical for high pin-count mezzanine designs where board real estate and weight are constrained in aerospace and defense applications.
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