TFM-147-12-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-147-12-S-D-A-P-TR is a high-reliability Tiger Eye dual-row terminal strip connector with 0.050 inch pitch and 94 pins in a straight through-hole configuration with polarized keying. It supports high-density board-to-board mezzanine interconnect and is packaged in tape-and-reel for automated assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TFM-147-12-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-147-12-S-D-A-P-TR?
- Tiger Eye dual-row configuration at 0.050 inch (1.27 mm) pitch delivers 94 pins in a straight through-hole layout, maximizing signal density for complex FPGA and processor mezzanine card interfaces
- Straight through-hole (S suffix) termination provides superior solder joint strength and mechanical anchoring, essential for connectors in high-vibration aerospace, defense, and industrial environments
- Polarized keying (-A-P) combined with tape-and-reel (TR) packaging eliminates orientation errors during automated assembly and field maintenance of high-pin-count PCB interconnects
What is TFM-147-12-S-D-A-P-TR used for?
The TFM-147-12-S-D-A-P-TR is designed for high-density through-hole mezzanine and board-to-board interconnect in advanced computing, defense electronics, and industrial automation platforms. Its 94-pin dual-row Tiger Eye contact system at 0.050 inch pitch supports wide data buses, multi-channel analog interfaces, and mixed-signal routing in FPGA, DSP, and SoC carrier board designs. The polarized keying and robust through-hole termination ensure long-term reliability and correct assembly in systems subject to harsh mechanical and thermal conditions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-147-12-S-D-A-P-TR datasheet?
TFM-147-12-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-147-12-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 94-pin count of TFM-147-12-S-D-A-P-TR benefit complex FPGA carrier board designs compared to lower pin-count connectors?
With 94 pins at 0.050 inch (1.27 mm) pitch in a dual-row layout, the TFM-147-12-S-D-A-P-TR can carry a full 64-bit data bus plus control, power, and ground signals in a single connector footprint smaller than many 50-pin 0.100 inch alternatives. This consolidation reduces the number of connector sites, simplifying board layout and improving signal integrity by shortening stub lengths on high-speed buses operating above 500 MHz.
What mechanical reliability does through-hole termination provide for TFM-147-12-S-D-A-P-TR in environments with shock and vibration?
Through-hole solder joints penetrate the PCB laminate and are anchored on both the component and solder side of the board, providing tensile pull-out strength typically exceeding 20 N per pin compared to 3 N to 5 N for equivalent SMT pads. For 94-pin connectors in aerospace or industrial equipment exposed to vibration levels above 10 g RMS, this retention advantage prevents pad delamination and maintains reliable electrical continuity across all pins during service life.
When selecting between TFM-147-12-S-D-A-P-TR and TFM-139-32-S-D-A-P-TR, what design factors drive the choice of the 94-pin variant?
The TFM-147-12-S-D-A-P-TR provides 94 pins versus 78 pins in the TFM-139-32-S-D-A-P-TR, both at 0.050 inch pitch in a dual-row straight through-hole form. The 94-pin variant is preferable when the interface requires more than 78 signals, such as wide DDR4 memory buses, full FPGA bank I/O assignments exceeding 70 pins, or combined power and signal routing that would otherwise require a second connector, thereby reducing board connector count and associated BOM cost.
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