TFM-147-12-L-D-A-P-TR SAMTEC Connector (Other) In Stock
The TFM-147-12-L-D-A-P-TR is a SAMTEC high-reliability Tiger Eye terminal strip with 0.050-inch pitch in a dual-row 94-pin low-profile through-hole configuration. It provides rugged board-to-board signal connections with reduced mating height ideal for compact stacked-board assemblies. Available in tape-and-reel with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TFM-147-12-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-147-12-L-D-A-P-TR?
- 0.050-inch (1.27 mm) pitch dual-row 94-pin configuration supporting high-density board-to-board signal and power routing
- Low-profile (L) mating height minimizing overall PCB stack separation for use in height-restricted enclosures and module formats
- Tape-and-reel (TR) packaging enabling seamless integration into automated SMT pick-and-place assembly lines
What is TFM-147-12-L-D-A-P-TR used for?
The TFM-147-12-L-D-A-P-TR is well suited for high-reliability mezzanine card and module interconnects in aerospace, defense, and industrial electronics where a 94-pin dual-row interface with reduced stack height is required. Its 1.27 mm pitch enables dense signal routing supporting differential pairs for SERDES or LVDS signals alongside single-ended control lines. The low-profile mating variant fits VITA-standard carrier card and FMC module designs with strict height budgets.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-147-12-L-D-A-P-TR datasheet?
TFM-147-12-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-147-12-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pin count does the TFM-147-12-L-D-A-P-TR offer and how does this compare to other TFM series variants?
The TFM-147-12-L-D-A-P-TR provides 94 pins in a dual-row layout at 1.27 mm pitch, placing it between the TFM-142-12-SM-D-A-P-TR with 84 pins and the TFM-150-22-FM-D-A-P-TR with 100 pins. The 94-pin count accommodates 47 differential pairs or a combination of 64 single-ended signals plus 30 ground and power pins, covering a wide range of FPGA daughter card and processor module interface requirements in compact enclosures.
How does the low-profile (L) designation affect the mating clearance in stacked PCB designs using TFM-147-12-L-D-A-P-TR?
The low-profile (L) suffix indicates the TFM-147-12-L-D-A-P-TR is designed with a reduced mated board separation, typically around 2 mm to 3 mm versus the 4 mm to 5 mm of standard-height TFM variants. This reduced clearance is critical for 3U VPX, OpenVPX, and FMC-compliant module stacks where the inter-board gap is fixed by mechanical standard and exceeding it by even 1 mm prevents proper slot insertion in the chassis.
Which application scenarios make the TFM-147-12-L-D-A-P-TR a better choice than the TFM-141-12-H-D-A-P-TR?
The TFM-147-12-L-D-A-P-TR is preferred over TFM-141-12-H-D-A-P-TR when the design needs 94 pins rather than 82 pins and requires the reduced 2 mm to 3 mm mating height of the low-profile series. The additional 12 contact positions support wider data buses or more differential pairs, while the lower stack height suits chassis-mounted mezzanine cards with less than 4 mm inter-board clearance, a constraint common in 1U rackmount embedded computing platforms.
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