TFM-147-12-H-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TFM-147-12-H-D-A-P-TR?

• 94-position dual-row layout at 0.050 inch (1.27 mm) pitch provides very high pin density for complex multi-signal mezzanine and daughter-card interconnects
• Horizontal (H) tail with post (P) anchoring combines low-profile SMT solderability with robust PCB mechanical retention against mating forces
• Tiger Eye dual-wipe contact geometry maintains low contact resistance below 20 milliohms across hundreds of mate and unmate cycles

What is TFM-147-12-H-D-A-P-TR used for?

The TFM-147-12-H-D-A-P-TR is designed for dense multi-channel board-to-board interconnects in FPGA expansion cards, embedded computing blades, and rugged industrial control systems requiring 94 signals at a compact 1.27 mm pitch. Its horizontal tail with post anchoring ensures solder joint reliability under vibration and thermal cycling conditions common in aerospace, defense, and transportation applications. The tape-and-reel format streamlines high-volume SMT automated assembly, reducing connector placement cycle time and handling cost.

Compliance & Regulatory

Where can I find the TFM-147-12-H-D-A-P-TR datasheet?

Official datasheet from SAMTEC

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