TFM-146-12-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-146-12-S-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050" (1.27 mm) pitch, dual-row configuration, and 46 positions per row for 92 total contacts. It features a standard SMT profile with polarization keying and tape and reel packaging for automated high-density board-to-board interconnection.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 92
- Lifecycle
- ACTIVE
- Datasheet
- TFM-146-12-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-146-12-S-D-A-P-TR?
- 92 total contacts at 0.050" (1.27 mm) pitch in a dual-row SMT footprint maximizes signal density for complex board-to-board interface requirements
- Standard SMT (-S) termination provides broad PCB design tool compatibility and reflow solder process integration without specialized pad geometries
- Polarization (-P) keying on the 92-pin body prevents reversed insertion, protecting logic signals at 1.8 V to 3.3 V from mating errors
- Tape and reel (-TR) packaging enables uninterrupted pick-and-place assembly for high-volume production with reduced handling defects
What is TFM-146-12-S-D-A-P-TR used for?
The TFM-146-12-S-D-A-P-TR is intended for high-density interconnection between mainboards and mezzanine modules in networking, storage, and embedded computing systems requiring up to 92 contacts at fine 0.050" pitch. Standard SMT termination simplifies PCB land pattern design and is compatible with conventional no-clean flux reflow soldering processes used in commercial electronics manufacturing. Polarization prevents field-service assembly errors on high-pin-count connectors where visual orientation cues are difficult to discern.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-146-12-S-D-A-P-TR datasheet?
TFM-146-12-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-146-12-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the total contact capacity of the TFM-146-12-S-D-A-P-TR and how is it configured?
The TFM-146-12-S-D-A-P-TR provides 92 total contacts arranged in 2 rows of 46 at a 0.050" (1.27 mm) pitch. The 46-position row spans approximately 58.4 mm, giving this connector one of the highest pin densities available in the TFM family while remaining compatible with standard SMT reflow assembly processes.
How does standard SMT termination (-S) on the TFM-146-12-S-D-A-P-TR simplify PCB manufacturing compared to special termination styles?
Standard SMT termination uses conventional surface mount pads compatible with typical 0.050" pitch land patterns already present in most PCB CAD libraries. This eliminates custom footprint creation, reduces the risk of pad geometry errors, and allows the connector to be soldered in standard no-clean flux reflow ovens at peak temperatures of 250–260°C without special profiles or fixtures.
For a high-channel data acquisition module with 92 analog and digital signals, why is the TFM-146-12-S-D-A-P-TR a suitable interconnect choice?
The TFM-146-12-S-D-A-P-TR provides exactly 92 contacts in a single connector, allowing all 92 channels to pass through one mated pair without requiring multiple parallel connectors. At 0.050" pitch the connector occupies roughly 58.4 mm of board edge, compared to 117 mm for the equivalent 0.100" pitch connector, which is significant when ADC front-end PCBs have constrained board widths below 80 mm.
What quality assurance does tape and reel packaging provide for the TFM-146-12-S-D-A-P-TR in production environments?
Tape and reel packaging orients each TFM-146-12-S-D-A-P-TR in a fixed pocket within the carrier strip, ensuring consistent pick-and-place nozzle engagement on the connector body. This eliminates the manual tray-loading step and reduces orientation defects during placement of a 92-pin fine-pitch part where misalignment by even 0.1 mm can cause solder bridging between adjacent 1.27 mm pitch pads.
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