TFM-146-12-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-146-12-F-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050" (1.27 mm) pitch, dual-row layout, and 46 positions per row providing 92 total contacts. It features a flush SMT termination profile with polarization keying and tape and reel packaging for automated precision board-to-board assembly.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 92
- Lifecycle
- ACTIVE
- Datasheet
- TFM-146-12-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-146-12-F-D-A-P-TR?
- Flush SMT termination (-F) produces a minimal solder fillet profile that reduces the risk of solder bridges between closely spaced 1.27 mm pitch pads during reflow
- 92 total contacts in a dual-row 0.050" pitch configuration routes high-bandwidth signals and power rails through a single 58.4 mm connector footprint
- Tiger Eye dual-beam contact mechanism maintains contact resistance below 20 mΩ per pin across repeated mating cycles for reliable high-speed interconnection
- Polarization keying (-P) and tape and reel (-TR) packaging prevent reversed insertion and enable high-throughput automated SMT production
What is TFM-146-12-F-D-A-P-TR used for?
The TFM-146-12-F-D-A-P-TR targets board-to-board and mezzanine interconnects in high-density communications, FPGA development platforms, and medical imaging systems requiring 92 precision contacts at 0.050" pitch. The flush termination style is preferred when PCB clearance near the connector is minimal and protrusion of solder fillets below the board surface could interfere with adjacent components or enclosure features. Combined with Tiger Eye contacts, the connector supports high-speed differential pairs and LVDS signals common in imaging and networking applications.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-146-12-F-D-A-P-TR datasheet?
TFM-146-12-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-146-12-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does flush SMT termination (-F) on the TFM-146-12-F-D-A-P-TR differ from standard SMT termination and when is it preferred?
Flush termination (-F) is designed so that the connector leads do not protrude below the PCB surface after soldering, while standard SMT (-S) allows small fillet protrusion. Flush termination is preferred when the underside of the PCB is within 0.5 mm of an enclosure floor or adjacent board, such as in slim embedded systems with a board-to-housing clearance under 1 mm, where even small solder fillet protrusions could cause shorts or mechanical interference.
What pin count and mating length does the TFM-146-12-F-D-A-P-TR provide for high-density interconnect designs?
The TFM-146-12-F-D-A-P-TR provides 92 total contacts in a dual-row layout of 46 per row at 0.050" (1.27 mm) pitch. The 46-position row occupies approximately 58.4 mm of PCB edge length, enabling high-bandwidth buses such as PCIe x8, 10 GbE XAUI, or 64-bit parallel memory interfaces to pass through a single connector footprint.
How does the TFM-146-12-F-D-A-P-TR compare to TFM-146-12-S-D-A-P-TR for selecting between flush and standard SMT profiles?
Both connectors share 92 contacts at 0.050" pitch with polarization and tape and reel packaging, differing only in termination style. TFM-146-12-F-D-A-P-TR uses flush termination that keeps leads at the PCB bottom surface plane, while TFM-146-12-S-D-A-P-TR uses standard SMT with small lead protrusion. Designers should choose the -F variant when bottom-side clearance is under 0.5 mm and the -S variant when standard reflow pad geometries are preferred for simpler board layout.
What production benefits does tape and reel packaging provide for TFM-146-12-F-D-A-P-TR in high-volume SMT manufacturing?
Tape and reel packaging pre-orients each 92-pin TFM-146-12-F-D-A-P-TR connector in a fixed carrier pocket, enabling automated pick-and-place machines to achieve placement accuracy within 0.05 mm on 1.27 mm pitch pads. This is essential for fine-pitch components where manual tray loading could introduce orientation offsets that cause solder bridges or misalignment across the 92-pin pattern, which would require rework at rates of 5–15 minutes per connector.
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