TFM-145-32-LM-D-A-P-TR SAMTEC Connector (Other) In Stock
The TFM-145-32-LM-D-A-P-TR is a SAMTEC Tiger Eye terminal strip with 0.050-inch pitch and 90 dual-row contacts in a low-profile surface-mount configuration. High-reliability Tiger Eye contacts provide consistent low contact resistance across extended mating cycles. Available in tape-and-reel packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TFM-145-32-LM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-145-32-LM-D-A-P-TR?
- 0.050-inch (1.27 mm) pitch dual-row design with 90 contacts enables maximum signal density in space-constrained PCB layouts
- Low-profile (LM) surface-mount termination minimizes total assembly height for thin-form-factor electronic systems
- Tiger Eye dual-beam contact mechanism maintains reliable electrical contact through 100 or more mating cycles
- Tape-and-reel packaging supports automated high-volume SMT assembly with standard pick-and-place equipment
What is TFM-145-32-LM-D-A-P-TR used for?
The TFM-145-32-LM-D-A-P-TR is designed for low-profile board-to-board interconnection in compact server modules, portable instrumentation, and FPGA mezzanine cards where a 0.050-inch pitch dual-row connector is required in a thin package stack. Its high contact count and reliable Tiger Eye contacts also make it suitable for aerospace avionics and defense electronics requiring dependable signal routing across extended service lifetimes.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-145-32-LM-D-A-P-TR datasheet?
TFM-145-32-LM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-145-32-LM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile (LM) termination of the TFM-145-32-LM-D-A-P-TR affect the overall board stack height compared to standard SM variants?
The low-profile LM termination reduces the mated stack height by approximately 1 mm to 2 mm compared to a standard surface-mount (SM) variant in the TFM series. For portable devices or compact enclosures requiring a board-to-board gap of less than 5 mm, this height reduction is critical to fitting the mated connector pair within the available mechanical clearance.
Which FPGA or processor board applications benefit most from the TFM-145-32-LM-D-A-P-TR's 90-contact dual-row layout?
High-speed FPGA mezzanine cards following the FMC (FPGA Mezzanine Card) standard typically route 68 to 160 differential pairs and power signals, making the TFM-145-32-LM-D-A-P-TR's 90-contact capacity suitable for medium-to-large FMC site designs. Its 0.050-inch pitch keeps the connector footprint under 30 mm in length, leaving sufficient routing area for 10 Gbps+ differential signal traces on 8-layer boards.
How should engineers verify that the TFM-145-32-LM-D-A-P-TR is compatible with their PCB reflow process during SMT assembly?
Engineers should confirm the TFM-145-32-LM-D-A-P-TR's solder temperature rating, which in SAMTEC's TFM series is typically 260°C peak per IPC/JEDEC J-STD-020 for 30 seconds maximum during reflow. Solder paste should be printed at 1.27 mm pitch using a stencil thickness of 0.12 mm to 0.15 mm, and the board must be inspected with X-ray or AOI to verify solder joint quality across all 90 contact pads after reflow.
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