TFM-145-04-H-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-145-04-H-D-LC is a high-reliability Tiger Eye terminal strip at 0.050 inch (1.27 mm) pitch with a dual-row, 45-position-per-row, high-profile low-clearance SMT configuration. Featuring 90 total contacts with redundant Tiger Eye retention, it suits demanding board-to-board stacking applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TFM-145-04-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-145-04-H-D-LC?
- 45-position dual-row Tiger Eye terminal strip at 0.050 inch pitch providing 90 total contacts for wide bus board-to-board applications
- High-profile low-clearance (H-LC) variant balances increased mating height with a compact inter-board stack for flexible mechanical integration
- Redundant two-point Tiger Eye contact geometry delivers contact resistance below 20 milliohms across 100+ mating cycles
What is TFM-145-04-H-D-LC used for?
The TFM-145-04-H-D-LC is designed for high-density board stacking in FPGAs, DSPs, and multi-core processor module interconnects where 90 simultaneous signal and power connections at 0.050 inch pitch are required. Its high-profile low-clearance SMT design provides added mating engagement depth while still fitting in compact chassis with limited inter-board clearance. Applications include radar signal processing boards, high-speed data acquisition systems, and rugged military avionics modules.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-145-04-H-D-LC datasheet?
TFM-145-04-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-145-04-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contacts does TFM-145-04-H-D-LC provide, and what bus widths does that enable?
The TFM-145-04-H-D-LC delivers 90 total contacts arranged in 2 rows of 45 positions at 0.050 inch (1.27 mm) pitch. This count supports 64-bit or wider parallel buses with additional power, ground, and control lines, making it suitable for FPGA daughter cards, DSP modules, and high-bandwidth memory interface boards in aerospace and defense systems.
What is the significance of the H-D-LC suffix in TFM-145-04-H-D-LC for stacked PCB enclosure design?
The H suffix indicates a high-profile variant that provides greater mating engagement than standard-height models, while LC denotes the low-clearance body that constrains total stack height. Together, these attributes allow the TFM-145-04-H-D-LC to seat firmly in mated connectors even under mechanical vibration, while keeping the two PCBs within approximately 6 mm to 10 mm of each other in a ruggedized enclosure.
How does ordering TFM-145-04-H-D-LC from authorized SAMTEC distributors compare to open-market sourcing for quality assurance?
Purchasing the TFM-145-04-H-D-LC through SAMTEC-authorized distributors guarantees traceability to manufacturer lot codes and compliance with SAMTEC's quality management system, which is certified to ISO 9001. Open-market or unauthorized channel purchases risk counterfeit or non-conforming parts that may not meet the connector's contact resistance specification of below 20 milliohms, leading to field failures in safety-critical aerospace or defense assemblies.
What solder paste and stencil specifications are recommended for reflowing TFM-145-04-H-D-LC on a high-density HDI PCB?
For the TFM-145-04-H-D-LC's 90 SMT pads at 0.050 inch (1.27 mm) pitch, a laser-cut stainless steel stencil with 0.5 mm to 0.6 mm aperture width and 0.12 mm to 0.15 mm stencil thickness is recommended to deposit sufficient solder volume without bridging adjacent pads. A Type 4 or finer solder paste compliant with IPC J-STD-006 supports the tight pad pitch and lead-free reflow profiles peaking at 260 °C.
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