TFM-145-03-SM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-145-03-SM-D-LC is a 90-position dual-row high-reliability Tiger Eye terminal strip with 0.050 inch pitch and SMT footprint with lead-free (LC) contact finish. Designed for dense high-speed board interconnects with superior contact reliability. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TFM-145-03-SM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-145-03-SM-D-LC?
- 90-position dual-row 0.050 inch (1.27 mm) pitch configuration providing high-density signal routing in a compact SMT footprint
- Tiger Eye dual-beam contact system with lead-free (LC) finish ensuring contact resistance below 10 milliohms across extended temperature and mating cycles
- SMT termination style compatible with automated reflow soldering for efficient high-volume PCB assembly
What is TFM-145-03-SM-D-LC used for?
The TFM-145-03-SM-D-LC is suited for high-density, high-reliability board-to-board interconnect applications in server, telecom, and aerospace electronics where 90-position dual-row connectivity at 0.050 inch pitch is required. Its Tiger Eye contact technology and lead-free finish meet RoHS compliance requirements for modern FPGA carrier boards, signal processing modules, and high-speed mezzanine card interfaces. The SMT footprint supports automated assembly processes in volume PCB manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-145-03-SM-D-LC datasheet?
TFM-145-03-SM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-145-03-SM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFM-145-03-SM-D-LC carry and what signal density does that enable at 0.050 inch pitch?
The TFM-145-03-SM-D-LC provides 90 positions in a dual-row arrangement at 0.050 inch (1.27 mm) pitch, enabling 90 independent signal or power connections within a connector footprint of approximately 57 mm by 3 mm. This density is twice that of comparable 0.100 inch pitch connectors, making it ideal for FPGA mezzanine cards, high-speed parallel buses, and dense backplane interconnects.
What does the lead-free (LC) contact finish designation mean for the TFM-145-03-SM-D-LC in a RoHS-compliant design?
The LC designation on the TFM-145-03-SM-D-LC indicates a lead-free contact finish that complies with RoHS Directive 2011/65/EU, making it suitable for consumer, industrial, and medical electronics that prohibit lead content above 0.1% by weight. The Tiger Eye gold-plated contact maintains contact resistance below 10 milliohms, ensuring signal integrity at high frequencies up to several GHz even without lead-based solder finishes.
When should a designer select the TFM-145-03-SM-D-LC over a lower-density 0.100 inch pitch alternative for a 90-signal interface?
A designer should choose the TFM-145-03-SM-D-LC when board area is limited and 90 signals must be routed through a single connector occupying less than 60 mm of PCB edge space at 0.050 inch pitch. Compared to a 0.100 inch pitch 90-position connector requiring over 115 mm of board edge, the TFM-145-03-SM-D-LC saves approximately 50 mm of PCB real estate, which is decisive in compact server blades, instrumentation chassis, and aerospace avionics modules.
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