TFM-144-23-FM-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-144-23-FM-D is a high-reliability Tiger Eye terminal strip connector with 0.050" pitch and 144 positions in a dual-row surface mount configuration. Features low-insertion-force Tiger Eye contacts rated for 0.5 A per pin. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- TFM-144-23-FM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- High-reliability Tiger Eye contact design rated at 0.5 A per pin for secure, low-insertion-force mating
- Ultra-fine 0.050" (1.27 mm) pitch enabling high-density 144-position dual-row layout in a compact PCB footprint
- Surface-mount termination with gold-plated contacts for low contact resistance and long-term corrosion resistance
Applications
The TFM-144-23-FM-D is suited for high-density board-to-board and board-to-cable interconnect applications in test and measurement equipment, military electronics, and industrial control systems. Its 0.050" pitch and 144-position count make it ideal for FPGA daughter-card interfaces and high-pin-count mezzanine connectors. The Tiger Eye contact system ensures reliable mating in vibration-prone environments found in aerospace and ruggedized computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFM-144-23-FM-D provide and what is its pitch?
The TFM-144-23-FM-D offers 144 positions arranged in a dual-row configuration with a 0.050" (1.27 mm) pitch, enabling a very high-density interconnect in a compact PCB area of approximately 3.66" × 0.1".
What current rating does each contact in the TFM-144-23-FM-D support for signal and power lines?
Each Tiger Eye contact in the TFM-144-23-FM-D is rated at 0.5 A per pin at 30 V AC/DC, making it suitable for signal-level lines and low-power rails in densely packed board-to-board assemblies with 144 positions.
Which high-pin-count FPGA or processor daughter-card designs benefit most from the TFM-144-23-FM-D?
FPGA mezzanine cards requiring more than 100 I/O lines benefit most, as the 144-pin dual-row 0.050" pitch layout routes all high-speed LVDS pairs, power, and ground signals in a footprint under 5 mm tall, fitting standard mezzanine stack heights of 8 mm or less.
When would an engineer choose the TFM-144-23-FM-D over a larger-pitch alternative like a 0.100" pitch connector?
Engineers choose the TFM-144-23-FM-D when board space is critical: the 0.050" pitch packs 144 positions in roughly half the PCB area of a 0.100" pitch equivalent, reducing connector zone length by approximately 50% and enabling PCB layer-count reductions of 1-2 layers in dense routing areas.
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