TFM-144-12-S-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TFM-144-12-S-D-A-P-TR?

• 88-position dual-row layout at 0.050-inch (1.27mm) pitch provides ultra-high signal density for compact FPGA and compute module interconnect
• Single-beam (S) surface-mount termination allows reflow soldering and eliminates PTH drilling for streamlined SMT board assembly
• Tape-and-reel (TR) packaging enables automated pick-and-place production with consistent component orientation and minimal waste

What is TFM-144-12-S-D-A-P-TR used for?

The TFM-144-12-S-D-A-P-TR is suited for high-density mezzanine and daughter-card interconnect in FPGA development boards, embedded compute modules, and high-speed signal processing platforms. Its 88-position dual-row configuration at 0.050-inch pitch routes 44 signals per row in a board footprint of approximately 55mm, making it significantly more area-efficient than 0.100-inch pitch alternatives. The SMT single-beam termination integrates cleanly into fully SMT assembly processes, reducing manufacturing cost and cycle time in volume production.

Compliance & Regulatory

Where can I find the TFM-144-12-S-D-A-P-TR datasheet?

Official datasheet from SAMTEC

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