TFM-143-23-H-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-143-23-H-D is a 43-position dual-row Tiger Eye high-reliability terminal strip with 0.050" (1.27mm) pitch for dense signal interconnects. The H height variant and D dual-row configuration support high pin-count board-to-board stacking in demanding environments. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TFM-143-23-H-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 43-position dual-row Tiger Eye contact system at 0.050" (1.27mm) pitch for maximum signal density in board-to-board interconnect applications
- H height variant provides extended stack height flexibility for mezzanine and module card designs requiring specific board separation dimensions
- High-reliability terminal strip construction with precision contacts rated for aerospace, defense, and industrial applications requiring consistent electrical performance
Applications
The TFM-143-23-H-D is designed for high-density board-to-board interconnect applications in military, aerospace, and industrial control systems, where its 43-position dual-row 0.050" pitch provides 86 signal contacts in a compact footprint. The Tiger Eye contact system ensures reliable electrical connections in vibration-prone environments such as avionic backplanes and ruggedized computing modules. It is also used in high-speed test and measurement equipment where precise contact geometry and repeatable mating forces are critical for signal integrity.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the H designator mean in TFM-143-23-H-D and how does it affect board stack height?
In SAMTEC TFM series nomenclature, the H designator specifies the terminal strip height variant, which determines the board-to-board separation distance when mated with a corresponding receptacle. For the TFM-143-23-H-D, the H height is typically 2.3mm above the PCB surface, allowing controlled stack heights in mezzanine configurations with a 0.050" (1.27mm) pitch over 43 dual-row positions.
How many signal contacts does TFM-143-23-H-D provide and what signal density does it achieve?
The TFM-143-23-H-D provides 86 total signal contacts in a dual-row (D) configuration with 43 positions per side at 0.050" (1.27mm) pitch. This yields a contact density of approximately 2 contacts per 1.27mm pitch spacing, enabling 86 discrete signal lines within a board footprint of approximately 54.6mm in length (43 positions × 1.27mm pitch).
When should TFM-143-23-H-D be chosen over SAMTEC TFM-143-23-L-D for a ruggedized backplane design?
Choose TFM-143-23-H-D over the L (low) height variant when the PCB stack-up requires a greater board separation distance, such as when routing high-current power traces or placing components between two stacked boards. The H height gives additional clearance of approximately 1mm more than the L variant for the same 43-position 0.050" dual-row layout, critical in backplanes where airflow channels or intermediate circuitry need space between the 86-contact mating planes.
Which soldering process is recommended for TFM-143-23-H-D and what footprint design rules apply?
TFM-143-23-H-D is a through-hole terminal strip intended for wave soldering or hand soldering processes rather than reflow. The 0.050" (1.27mm) pitch dual-row layout requires a 2-row through-hole pattern with 1.27mm row-to-row spacing. SAMTEC recommends a 0.65mm drill diameter for the 86 contact pins, with solder mask defined pads to prevent bridging between the closely spaced 1.27mm pitch contacts during wave solder processing.
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