TFM-143-04-L-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-143-04-L-D-LC is an 86-position high-reliability Tiger Eye dual-row terminal strip at 0.050 inch pitch, low-profile surface mount vertical, with board lock and gold flash over nickel contacts for secure dense interconnection.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TFM-143-04-L-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-143-04-L-D-LC?
- 86-position dual-row surface mount layout at 0.050 inch (1.27 mm) pitch provides very high contact density in a minimal PCB footprint
- Board lock (LC suffix) secures the connector mechanically before and during solder reflow, improving SMT process yield on large multi-pin connectors
- Low-profile vertical surface mount orientation minimizes stack height above the PCB for thin-form-factor card and module designs
What is TFM-143-04-L-D-LC used for?
The TFM-143-04-L-D-LC is designed for high-pin-count board-to-board interconnect in server blades, FPGA mezzanine cards, and high-speed data acquisition systems needing 86 positions at 0.050 inch pitch. The board lock feature is particularly valuable during automated reflow assembly of large PCBs where connector movement before solder joint formation would cause misalignment. Its low-profile vertical mounting suits thin enclosures in medical electronics and ruggedized industrial computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-143-04-L-D-LC datasheet?
TFM-143-04-L-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-143-04-L-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why is the board lock feature on the TFM-143-04-L-D-LC critical for 86-position SMT connector assembly?
An 86-position connector at 0.050 inch pitch spans approximately 2.150 inches (54.6 mm) and has significant mass that can shift on solder paste during reflow. The board lock (LC suffix) mechanically anchors the connector to the PCB through press-fit pegs before reflow, preventing movement that would misalign all 86 contacts and cause solder bridging or opens. This is especially important in lead-free reflow profiles that reach 260 degrees C.
How does the TFM-143-04-L-D-LC low-profile design help in FPGA mezzanine card applications?
The low-profile surface mount vertical orientation reduces the connector stack height above the PCB to under 5 mm, enabling FPGA mezzanine cards and daughter cards to fit within tight chassis card-slot pitches of 6 to 12 mm. With 86 positions at 0.050 inch pitch, it can carry high-speed LVDS and LVCMOS signals between FPGA banks on adjacent boards without consuming excessive vertical clearance.
How does the 86-position TFM-143-04-L-D-LC compare to a 72-position alternative for a high-speed parallel bus?
If your parallel bus requires 86 data, address, control, and ground lines, the TFM-143-04-L-D-LC provides exactly that in a single 0.050 inch pitch dual-row connector without requiring a second connector or stacking arrangement. Selecting an 86-position part over a 72-position connector avoids signal multiplexing overhead and keeps your bus timing at full 1-to-1 parallel throughput across all 86 lines simultaneously.
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