TFM-143-04-H-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-143-04-H-D-LC is a high-reliability Tiger Eye dual-row terminal strip with 143 pins at 0.050-inch pitch in a high-profile, lead-free configuration. Designed for dense PCB interconnects requiring RoHS compliance and consistent signal integrity across multiple mating cycles. Available from authorized distributors worldwide with in-stock inventory.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TFM-143-04-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 143 dual-row pins at 0.050-inch pitch enable ultra-high-density signal routing in compact PCB assemblies
- High-profile design accommodates larger board separations in stacked PCB and mezzanine interconnect applications
- Lead-free contacts (LC) ensure full RoHS compliance for green electronics manufacturing environments
Applications
The TFM-143-04-H-D-LC is designed for high-density board-to-board and mezzanine interconnects in telecommunications, computing, and industrial control systems requiring 143 signal channels. Its high-profile dual-row configuration at 0.050-inch pitch supports stacked PCB assemblies where larger board separations are needed alongside rigorous signal integrity requirements. This connector suits lead-free production environments where reliable multi-channel data transfer at compact pitch is essential.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins does the TFM-143-04-H-D-LC provide and what spacing is used between contacts?
The TFM-143-04-H-D-LC features 143 pins in a dual-row arrangement at 0.050-inch pitch, enabling high-density signal routing across compact PCBs. This pin count supports up to 143 individual signal connections in a minimal board footprint, making it suitable for multi-channel digital and analog interconnect designs in computing and industrial platforms.
Which stacked-board applications benefit most from the TFM-143-04-H-D-LC high-profile design?
The TFM-143-04-H-D-LC high-profile variant is best suited for mezzanine and backplane assemblies where boards are separated by a larger standoff height. Carrying more than 100 channels at 0.050-inch pitch, it supports telecom line cards, FPGA mezzanine modules, and embedded computing daughterboards where dense signal routing and mechanical clearance must both be satisfied.
What temperature range does TFM-143-04-H-D-LC support and is it RoHS compliant?
The TFM-143-04-H-D-LC operates across temperatures from -40°C to +85°C and uses lead-free contacts through its LC designation, satisfying RoHS compliance requirements. All 143 pins maintain consistent electrical continuity across this thermal range, making it compatible with commercial and industrial electronics assemblies where tin-lead solder processes are not permitted.
How does the 143-pin TFM-143-04-H-D-LC compare to lower-count TFM variants for large signal buses?
The TFM-143-04-H-D-LC provides 143 pins versus typical 40-pin or 60-pin TFM variants at the same 0.050-inch pitch, delivering more than twice the channel count in a single connector. This reduces the number of connectors required on a multi-board backplane, simplifying PCB layout and improving routing efficiency for large digital buses exceeding 100 channels.
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