TFM-143-02-LM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-143-02-LM-D-LC is an 86-position Tiger Eye terminal strip with 0.050 inch pitch, surface-mount vertical orientation, and dual-row layout. It delivers high-reliability mating performance for dense board-to-board signal connections. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 86
- Lifecycle
- ACTIVE
- Datasheet
- TFM-143-02-LM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-143-02-LM-D-LC?
- 86-position dual-row surface-mount vertical configuration on 0.050 inch (1.27 mm) pitch for ultra-high-density PCB interconnects
- Tiger Eye contact design rated for over 200 mating cycles with low-insertion-force engagement and reliable electrical contact
- Surface-mount termination with vertical profile enables automated reflow assembly on high-layer-count backplane and mezzanine boards
What is TFM-143-02-LM-D-LC used for?
The TFM-143-02-LM-D-LC is designed for high-density board-to-board and mezzanine interconnect applications in telecommunications switching, FPGA compute modules, and data-center server boards. Its 86-position dual-row vertical surface-mount design provides 86 signal paths within a compact 0.050 inch pitch footprint, maximizing interconnect density on space-constrained PCBs. The Tiger Eye contacts ensure consistent electrical performance across repeated mating cycles in hot-swap and field-service scenarios typical of rack-mounted network equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-143-02-LM-D-LC datasheet?
TFM-143-02-LM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-143-02-LM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does TFM-143-02-LM-D-LC carry, and how are they arranged on the board?
The TFM-143-02-LM-D-LC provides 86 contacts arranged in a dual-row vertical surface-mount configuration, with 43 positions per row on a 0.050 inch (1.27 mm) pitch. This high-density layout enables 86 signal lines to be routed through a connector footprint roughly half the board area of an equivalent 0.100 inch pitch alternative.
Which server and telecom board designs benefit most from the vertical surface-mount orientation of TFM-143-02-LM-D-LC?
Vertical surface-mount orientation is ideal for rack-mount server line cards, FPGA mezzanine modules, and telecom switching blades where stacked board assemblies require the connector profile to remain within a tightly controlled height budget, typically under 5 mm above the PCB surface. The TFM-143-02-LM-D-LC's vertical SMT footprint also allows reflow soldering in the same pass as other SMT components, reducing assembly steps and cost.
When comparing TFM-143-02-LM-D-LC to a 0.100 inch pitch 86-position header, what board-space savings can designers expect?
Switching from a 0.100 inch (2.54 mm) pitch 86-position connector to the TFM-143-02-LM-D-LC at 0.050 inch (1.27 mm) pitch reduces the connector footprint length by approximately 50%, freeing board area that can be used for additional circuitry or to reduce PCB size and cost. This size advantage is critical for high-layer-count backplanes and compact mezzanine cards with more than 4 connectors sharing a single board edge.
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About SAMTEC
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