TFM-141-22-F-D-A-P-TR SAMTEC Connector (Other) In Stock
The TFM-141-22-F-D-A-P-TR is a SAMTEC high-reliability Tiger Eye terminal strip with 0.050-inch pitch in a dual-row 82-pin configuration with compliant-pin press-fit termination. It supports robust board-to-board signal interconnects without solder reflow in high-reliability applications. Available in tape-and-reel with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TFM-141-22-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-141-22-F-D-A-P-TR?
- 0.050-inch (1.27 mm) pitch dual-row 82-pin layout for high-density PCB-to-PCB signal routing
- Compliant-pin (F) press-fit termination enabling solderless through-board assembly for improved reliability
- Tape-and-reel packaging for seamless integration into automated SMT assembly processes
What is TFM-141-22-F-D-A-P-TR used for?
The TFM-141-22-F-D-A-P-TR is designed for high-reliability board-to-board interconnect in defense, aerospace, and industrial control systems. Its press-fit termination avoids solder-joint failure risks in high-vibration environments, making it ideal for backplane and mezzanine card applications with 82 dual-row contact positions. The 0.050-inch pitch supports compact multi-signal bus routing on dense multilayer PCBs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-141-22-F-D-A-P-TR datasheet?
TFM-141-22-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-141-22-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What termination style does the TFM-141-22-F-D-A-P-TR use and what are its assembly advantages?
The TFM-141-22-F-D-A-P-TR uses compliant-pin (press-fit) termination, where each of the 82 pins per row is mechanically pressed into a plated through-hole without solder. This solderless process eliminates thermal stress from reflow on the 1.27 mm pitch contacts and produces a gas-tight connection that resists vibration-induced failure, which is critical for military and aerospace board assemblies.
How does the TFM-141-22-F-D-A-P-TR compare to a soldered version for backplane use?
Compared to a solder-tail version, the TFM-141-22-F-D-A-P-TR with press-fit termination provides a more reliable backplane connection because the mechanical interference fit at each of its 82 pins maintains electrical contact without solder cold-joint risk over a temperature range of -55°C to +125°C. Solder tails require careful reflow profiling, while press-fit pins are installed at room temperature in a single press operation.
What connector alternatives should engineers evaluate alongside the TFM-141-22-F-D-A-P-TR for 82-pin dual-row bus designs?
Engineers evaluating the TFM-141-22-F-D-A-P-TR for 82-pin dual-row bus designs at 1.27 mm pitch can also consider the SAMTEC TFM-141-12-H-D-A-P-TR for a press-fit alternative with different height profiles, or the SAMTEC ASP series for higher-speed differential-pair rated interconnects. The choice depends on whether the system requires mating heights below 5 mm, press-fit versus SMT termination, or data rates above 10 Gbps per channel.
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