TFM-141-03-STL-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-141-03-STL-D-LC is a high-reliability Tiger Eye terminal strip with 0.050 inch (1.27 mm) pitch in an 82-position dual-row low-clearance SMT configuration with solder tail leads. It combines the Tiger Eye contact design with a low-clearance stacking height to support dense, multi-board assemblies requiring high pin counts. This connector is built for demanding board-to-board interconnect applications in space-constrained high-performance systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TFM-141-03-STL-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-141-03-STL-D-LC?
- 82-position dual-row Tiger Eye SMT terminal strip at 0.050 inch (1.27 mm) pitch for ultra-high-density interconnect
- Solder tail leads (STL) for secure board attachment combined with low-clearance (LC) stacking for minimal board separation
- Proprietary Tiger Eye contact providing oxide-wiping action and elevated normal force for reliable low-resistance mating
What is TFM-141-03-STL-D-LC used for?
The TFM-141-03-STL-D-LC is ideal for high-pin-count mezzanine connections in FPGA compute boards, high-speed switching fabrics, and advanced data storage controllers where 82 positions must be routed through a 0.050 inch pitch SMT connector with minimal stacking height. The solder tail construction adds mechanical robustness for retention during thermal cycling. Its Tiger Eye contacts maintain signal integrity across repeated mating cycles in high-reliability telecom and computing infrastructure.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-141-03-STL-D-LC datasheet?
TFM-141-03-STL-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-141-03-STL-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFM-141-03-STL-D-LC offer and how does the dual-row layout help with board density?
The TFM-141-03-STL-D-LC provides 82 positions in a dual-row configuration at 0.050 inch (1.27 mm) pitch, placing 41 positions per row. This dual-row layout reduces the required connector length by half compared to a single-row 82-position strip, significantly conserving PCB real estate in dense board-to-board mezzanine designs.
What mechanical advantage do the solder tail leads (STL) provide in the TFM-141-03-STL-D-LC?
The solder tail leads anchor the connector body to the PCB at additional points beyond the SMT signal pads. This increases pull-out force retention and reduces the risk of connector delamination during thermal cycling or mechanical shock, making the 82-position TFM-141-03-STL-D-LC suitable for ruggedized equipment operating across wide temperature ranges.
For which high-speed signal applications is the TFM-141-03-STL-D-LC well suited compared to lower pin-count alternatives?
The 82-position, 0.050 inch pitch configuration of the TFM-141-03-STL-D-LC targets applications requiring large numbers of parallel signal lanes, such as FPGA-to-memory interfaces, multi-gigabit switching fabrics, or high-channel-count DAQ boards. These designs benefit from routing 82 signals through a single compact connector rather than using multiple lower-count connectors.
How does the low-clearance (LC) option in the TFM-141-03-STL-D-LC affect the overall PCB stack height?
The low-clearance designation reduces the mated board-to-board separation height compared to the standard TFM series. For systems requiring PCB assemblies to fit within enclosures thinner than standard mezzanine stacks, the LC option can save several millimeters of height across 82 mated positions, enabling slimmer multi-board system designs.
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