TFM-140-23-H-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-140-23-H-D is a high-reliability Tiger Eye dual-row terminal strip with 0.050" (1.27 mm) pitch and 80 total positions for dense surface mount interconnects. Features SAMTEC's Tiger Eye contact system for superior normal force and reliable mating cycles. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TFM-140-23-H-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- High-reliability Tiger Eye contact system providing superior normal force and consistent mating performance
- 80-position dual-row configuration at 0.050" (1.27 mm) pitch for ultra-high-density PCB interconnects
- Low-profile design enabling compact board stacking in space-constrained mezzanine and module applications
- Gold-plated contacts ensuring signal integrity and resistance to oxidation over extended service life
Applications
The TFM-140-23-H-D is engineered for high-density mezzanine board stacking, FPGA daughter card interfaces, and module-to-backplane interconnects in telecommunications and aerospace applications. Its 0.050" pitch Tiger Eye contact system provides 80 reliable signal or power connections in a minimal board footprint, suitable for embedded computing platforms and high-speed data acquisition systems. The dual-row layout supports high-speed differential pair routing for gigabit-class serial interfaces in demanding industrial and defense electronics.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What makes the Tiger Eye contact system in TFM-140-23-H-D superior to standard socket contacts?
SAMTEC's Tiger Eye contact design uses a dual-beam wiping action that generates higher normal force than conventional single-beam contacts, typically achieving over 100 grams of contact force per pin. This results in better resistance to vibration-induced intermittent contacts and maintains reliable electrical connection over thousands of mating cycles in harsh environments.
How many total positions does TFM-140-23-H-D provide and how are they arranged?
The TFM-140-23-H-D provides 80 total contact positions arranged in 2 rows of 40 contacts each at 0.050" (1.27 mm) pitch. This dual-row high-density configuration enables routing up to 80 signal or power connections within a board footprint of approximately 50.8 mm × 5.08 mm, making it suitable for wide parallel bus and multi-channel high-speed interfaces.
In what high-reliability applications is TFM-140-23-H-D most commonly specified?
The TFM-140-23-H-D is specified in aerospace avionics, defense electronics, and industrial control systems where connector reliability over 500 or more mating cycles is required. Its 0.050" pitch dual-row layout supports 80-pin high-density mezzanine card interconnects in applications operating from -55°C to +125°C, including ruggedized embedded computing modules and FPGA-based signal processing platforms.
How does the 0.050" pitch of TFM-140-23-H-D compare to 0.100" pitch connectors for board density?
The 0.050" (1.27 mm) pitch of TFM-140-23-H-D provides approximately 4 times higher pin density per unit area compared to 0.100" (2.54 mm) pitch connectors. With 80 positions in the same board length that a 0.100" connector would use for 40 positions, TFM-140-23-H-D is preferred for high pin-count mezzanine applications where minimizing connector real estate is critical.
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