TFM-140-22-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-140-22-F-D-A-P-TR is an 80-position dual-row high-reliability Tiger Eye terminal strip with 0.050-inch pitch, through-hole compliant-press-fit termination, and tape-and-reel packaging. Gold-plated contacts deliver low contact resistance across hundreds of mating cycles for dense signal interconnect applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TFM-140-22-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-140-22-F-D-A-P-TR?
- 80-position dual-row configuration at 0.050-inch (1.27mm) pitch enables high-density signal routing in compact embedded and FPGA board designs
- Through-hole compliant-press-fit (F) termination allows solderless installation with reliable gas-tight contact in PTH PCB vias
- Tiger Eye dual-beam contact geometry maintains contact resistance below 20 milliohms over 200 or more mating cycles
What is TFM-140-22-F-D-A-P-TR used for?
The TFM-140-22-F-D-A-P-TR serves high-density board-to-board and daughter-card interconnect in FPGA evaluation boards, high-speed data acquisition systems, and telecommunications switch cards. Its 80-position dual-row layout at 0.050-inch pitch routes 40 signals per row across a footprint of approximately 50mm, reducing board area by roughly 50% compared to 0.100-inch pitch alternatives. Tape-and-reel packaging enables automated SMT and press-fit assembly for volume production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-140-22-F-D-A-P-TR datasheet?
TFM-140-22-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-140-22-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does TFM-140-22-F-D-A-P-TR's compliant-press-fit termination differ from standard through-hole solder termination for high-vibration environments?
The compliant-press-fit (F) termination on TFM-140-22-F-D-A-P-TR creates a gas-tight mechanical connection in a standard PTH via without solder, which is particularly advantageous in high-vibration environments. While solder joints can crack under thermal cycling stress, the press-fit contact maintains reliable electrical continuity rated to typically 1 ampere per pin because the spring-back force of the compliant zone keeps the contact firmly engaged within the via wall.
For an FPGA evaluation board with 80 GPIO signals, what board area does TFM-140-22-F-D-A-P-TR require compared to a 0.100-inch dual-row header?
The TFM-140-22-F-D-A-P-TR at 0.050-inch pitch occupies a connector footprint of approximately 50mm length by 2.54mm row spacing for 80 positions. An equivalent 80-position dual-row connector at 0.100-inch pitch would span roughly 100mm, doubling the PCB length consumed. This 50% footprint reduction is critical on dense FPGA evaluation boards where multiple high-count connectors compete for limited routing area.
When should a designer choose TFM-140-22-F-D-A-P-TR over a zero-insertion-force (ZIF) connector for a daughter-card interface?
TFM-140-22-F-D-A-P-TR is preferable to a ZIF connector when the daughter card is inserted and removed infrequently, fewer than 50 to 100 times over the product lifetime, and when low profile and small footprint matter more than effortless insertion. The Tiger Eye contact design provides positive retention force that prevents vibration-induced disconnection at the 0.050-inch pitch, whereas ZIF connectors use a latch mechanism that can wear out more quickly under repeated high-cycle use in automated test environments.
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