TFM-140-04-SM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-140-04-SM-D-LC is a Tiger Eye terminal strip with 0.050" pitch, 80 positions dual-row, SM termination style for high-density SMT board connections. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TFM-140-04-SM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-140-04-SM-D-LC?
- 0.050" (1.27 mm) pitch dual-row design enabling 80 positions in a compact SMT footprint
- Tiger Eye contact system delivers enhanced normal force for reliable signal integrity over extended mating cycles
- SM surface-mount termination compatible with standard reflow soldering up to 260°C peak temperature
What is TFM-140-04-SM-D-LC used for?
The TFM-140-04-SM-D-LC is designed for high-density board-to-board and mezzanine interconnect applications in data communications, networking, and embedded computing hardware. Its 80-position dual-row layout at 0.050" pitch supports dense signal routing in compact module designs. The surface-mount termination style simplifies automated PCB assembly while maintaining reliable electrical performance across industrial operating environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-140-04-SM-D-LC datasheet?
TFM-140-04-SM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-140-04-SM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of TFM-140-04-SM-D-LC compare to standard 0.100" pitch connectors for high-density designs?
The TFM-140-04-SM-D-LC uses a 0.050" (1.27 mm) pitch, which is half the spacing of standard 0.100" pitch connectors. This allows 80 positions in a dual-row format within roughly half the board space, enabling designers to achieve significantly higher interconnect density for compact PCB modules and mezzanine assemblies.
Can the TFM-140-04-SM-D-LC be processed through standard lead-free reflow soldering?
Yes, the TFM-140-04-SM-D-LC features an SM (surface-mount) termination style that is compatible with lead-free reflow soldering processes at peak temperatures up to 260°C. It supports standard pick-and-place assembly, making it suitable for high-volume automated production lines without requiring manual soldering steps.
In which industries is the TFM-140-04-SM-D-LC commonly used and what signal types does it support?
The TFM-140-04-SM-D-LC is commonly deployed in data communications, networking equipment, and embedded computing modules where 80-pin dual-row connectivity at 0.050" pitch is required. It supports high-speed digital signals, with contact resistance typically below 20 milliohms, making it effective for parallel bus and general-purpose I/O interconnects in industrial and commercial applications.
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