TFM-139-32-STL-D-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TFM-139-32-STL-D-A-P-TR is a high-reliability Tiger Eye dual-row terminal strip with 0.050" (1.27 mm) pitch, 39 positions per row, stand-off low-profile SMT style in tape-and-reel packaging for high-density board-to-board interconnect.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-139-32-STL-D-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
78
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TFM-139-32-STL-D-A-P-TR?

  • Tiger Eye contacts on a fine 0.050" pitch ensure reliable dual-row signal integrity in high-vibration environments
  • Stand-off low-profile (-STL) style provides controlled board-to-board spacing for mezzanine and backplane designs
  • Tape-and-reel (-TR) packaging enables fully automated SMT pick-and-place for high-volume manufacturing

What is TFM-139-32-STL-D-A-P-TR used for?

The TFM-139-32-STL-D-A-P-TR serves board-to-board mezzanine connections in high-density embedded computing, network switching cards, and defense electronics where a controlled stand-off height and fine 0.050" pitch are required. Its 78-contact dual-row layout handles both signal and auxiliary power routing between stacked PCBs, making it well-suited for FPGA mezzanine modules, DSP carrier boards, and instrument backplanes.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the TFM-139-32-STL-D-A-P-TR datasheet?

TFM-139-32-STL-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TFM-139-32-STL-D-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What total contact count does the TFM-139-32-STL-D-A-P-TR offer, and at what pitch are those contacts arranged?

The TFM-139-32-STL-D-A-P-TR provides 39 positions per row across 2 rows, giving 78 total contacts arranged on a 0.050" (1.27 mm) pitch. This combination of high contact count and fine pitch allows engineers to route a large number of digital signals, clocks, and auxiliary power rails across a mezzanine interface without significant PCB area penalty.

What does the stand-off low-profile (-STL) designation control in the TFM-139-32-STL-D-A-P-TR, and why does it matter for stacked PCB designs?

The -STL designation specifies a stand-off low-profile height, providing a defined gap between the mating PCBs when the TFM-139-32-STL-D-A-P-TR is installed. This controlled stand-off ensures consistent board-to-board spacing, which is critical for maintaining signal integrity on high-speed traces and for providing adequate clearance for components mounted on the lower board surface in 78-contact mezzanine assemblies.

For a compact FPGA carrier board, how does the tape-and-reel format of TFM-139-32-STL-D-A-P-TR support production scaling?

The -TR suffix indicates the TFM-139-32-STL-D-A-P-TR ships on tape and reel, compatible with standard SMT pick-and-place feeders used in production volumes exceeding thousands of units. For FPGA carrier boards requiring precise placement of the 78-pin dual-row connector, automated reel feeding eliminates manual alignment errors and supports consistent solder joint quality across high-volume build runs.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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