TFM-139-32-F-D-A-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TFM-139-32-F-D-A-P-TR is a high-reliability Tiger Eye™ terminal strip with 78 positions in a dual-row, 0.050 inch (1.27 mm) pitch surface mount configuration for demanding board-to-board interconnect applications. It features a female dual-row layout with precision Tiger Eye™ contacts engineered for high mating cycle life in aerospace, defense, and high-performance computing designs. Supplied in tape-and-reel packaging, it enables automated high-volume SMT assembly with consistent placement accuracy and global distributor availability.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TFM-139-32-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-139-32-F-D-A-P-TR?
- 78-position (39 per row) dual-row layout on 0.050 inch pitch delivers high contact density for fine-pitch board-to-board interconnect
- Tiger Eye™ high-reliability contact design provides enhanced wiping action and consistent low contact resistance across extended mating cycles
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly for efficient and accurate high-volume production
- Female dual-row (D) construction mates with SAMTEC TFM-compatible headers for secure and repeatable board-level signal connections
What is TFM-139-32-F-D-A-P-TR used for?
The TFM-139-32-F-D-A-P-TR is specified for high-reliability board-to-board interconnect applications in aerospace, defense electronics, industrial test equipment, and high-performance computing where 0.050 inch pitch and long mating life are critical requirements. Its 78-position dual-row configuration with Tiger Eye™ contact technology supports high-signal-count daughter card and mezzanine board interfaces requiring consistent electrical performance across thousands of mating cycles. Engineers also select this connector for modular instrumentation, FPGA development platforms, and communications backplanes where precision alignment and contact integrity under vibration are design priorities.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-139-32-F-D-A-P-TR datasheet?
TFM-139-32-F-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-139-32-F-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the TFM-139-32-F-D-A-P-TR provide, and what is its pitch specification?
The TFM-139-32-F-D-A-P-TR provides 78 pins arranged in two rows of 39 contacts each on a 0.050 inch (1.27 mm) pitch, delivering high contact density within a compact board footprint. The Tiger Eye™ contact design maintains consistent low contact resistance across thousands of mating cycles, supporting signal integrity in high-cycle applications such as test fixtures and reconfigurable systems.
In which high-reliability environments is the TFM-139-32-F-D-A-P-TR connector most commonly deployed?
The TFM-139-32-F-D-A-P-TR is deployed in aerospace and defense electronics, industrial test and measurement equipment, and FPGA mezzanine board interfaces where 78 pins of dual-row connectivity at 0.050 inch pitch must withstand demanding mechanical and thermal environments. The Tiger Eye™ contact technology ensures reliable mating performance over extended lifecycle and in conditions subject to mechanical shock and vibration.
What production advantages does the tape-and-reel format provide for the TFM-139-32-F-D-A-P-TR?
Tape-and-reel packaging allows the 78-pin dual-row TFM-139-32-F-D-A-P-TR to feed directly into automated pick-and-place machines, ensuring consistent orientation and placement accuracy during high-volume SMT reflow assembly at 0.050 inch pitch. This packaging eliminates manual handling risks, reduces misplacement rates on fine-pitch footprints, and increases production line throughput for high-reliability electronic assemblies.
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