TFM-139-13-SM-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-139-13-SM-D is a high-reliability Tiger Eye terminal strip with 0.050" pitch and 78 contacts (39 per row). Features dual-row SMT surface-mount configuration with gold-plated contacts for secure signal integrity. Available from stock worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TFM-139-13-SM-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-139-13-SM-D?
- 0.050" (1.27 mm) ultra-fine pitch dual-row terminal strip for high-density board-to-board connections
- Tiger Eye contact system delivers reliable 4-point contact with 100 g minimum normal force per pin
- Gold-plated contacts with 30 µin minimum plating thickness for corrosion resistance and low contact resistance
- Surface-mount (SM) configuration with tape-and-reel packaging option for automated PCB assembly
- High-reliability design rated for 500 mating cycles and operating temperatures from -55°C to +125°C
What is TFM-139-13-SM-D used for?
The TFM-139-13-SM-D is designed for high-density board-to-board and wire-to-board interconnect applications in telecommunications, networking, and industrial control systems. Its 0.050-inch pitch and 78-pin dual-row layout make it ideal for compact PCB assemblies in servers, data acquisition equipment, and test instrumentation. The surface-mount package suits automated assembly environments requiring reliable signal transmission at 2 A per contact.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-139-13-SM-D datasheet?
TFM-139-13-SM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-139-13-SM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TFM-139-13-SM-D connector?
The TFM-139-13-SM-D has 78 total contacts arranged in 2 rows of 39 pins each, with a 0.050-inch (1.27 mm) pitch. This compact spacing allows dense interconnections on PCBs with limited board real estate, making it suitable for high-density applications requiring many signal lines in a small footprint.
Which thermal environments can the TFM-139-13-SM-D withstand during operation?
The TFM-139-13-SM-D operates reliably across a temperature range of -55°C to +125°C, making it suitable for both industrial and harsh environments. The gold-plated Tiger Eye contacts maintain consistent electrical performance at 30 µin plating thickness across this entire thermal range without degradation.
How does the Tiger Eye contact design in TFM-139-13-SM-D compare to standard stamped contacts?
Unlike standard stamped contacts, the Tiger Eye design provides a 4-point contact engagement that distributes the 100 g normal force per pin across multiple contact points, lowering contact resistance to under 20 milliohms and increasing reliability over 500 rated mating cycles. This design reduces fretting corrosion common in vibration-prone applications such as industrial machinery and avionics.
What current rating does TFM-139-13-SM-D support per pin, and is it suitable for mixed signal and power lines?
Each pin in the TFM-139-13-SM-D supports up to 2 A current, allowing designers to allocate certain pins for low-voltage power distribution while using adjacent pins for high-speed signal lines. With 78 pins total, the connector can aggregate up to several amps of combined power across dedicated power pins in a board-to-board topology.
When is TFM-139-13-SM-D a better procurement choice than a 0.100-inch pitch connector for the same application?
When board space is constrained to areas smaller than 50 mm x 10 mm yet 78 or more signal connections are needed, the TFM-139-13-SM-D at 0.050-inch (1.27 mm) pitch occupies roughly half the PCB footprint compared to a 0.100-inch pitch equivalent. This makes it preferable in compact industrial controllers, medical devices, and portable test equipment where saving 20 mm or more of PCB length is critical to meeting mechanical envelope requirements.
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