TFM-139-04-H-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-139-04-H-D-LC is a high-reliability Tiger Eye dual-row terminal strip at 0.050" pitch with 78 positions and a high-pin-count surface-mount footprint for dense board interconnects. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TFM-139-04-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-139-04-H-D-LC?
- 78-position dual-row layout at 0.050" (1.27 mm) pitch delivers high-density signal routing in a compact surface-mount footprint
- Tiger Eye contact technology provides reliable dual-beam wiping action for thousands of mating cycles in demanding environments
- H-height option accommodates stack heights where additional clearance is required above the PCB surface
What is TFM-139-04-H-D-LC used for?
The TFM-139-04-H-D-LC is suited for high-density board-to-board interconnects in aerospace avionics, defense electronics, and high-performance computing platforms that require 78 signals at 0.050" pitch. Its Tiger Eye contact and surface-mount construction support automated SMT assembly and deliver consistent, low-resistance connections in vibration-prone installations. Medical imaging equipment and instrumentation systems also benefit from its high reliability and compact 0.050" pitch footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-139-04-H-D-LC datasheet?
TFM-139-04-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-139-04-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFM-139-04-H-D-LC carry, and at what pitch are they arranged?
The TFM-139-04-H-D-LC provides 78 positions in a dual-row configuration on a 0.050" (1.27 mm) pitch. This combination delivers 39 contacts per row in an ultra-compact footprint, enabling very high-density board-to-board signal connections in miniaturized aerospace, defense, and computing designs.
What is the significance of the H-height designation in TFM-139-04-H-D-LC for board stacking?
The H-height designation specifies a taller insulator body compared to standard-height TFM variants, providing additional clearance between mated PCBs. This is important in stacked-board designs where components near the connector require a minimum standoff of several millimeters, allowing the 0.050" pitch dual-row interface to accommodate components on both boards without mechanical interference.
In what sectors is the TFM-139-04-H-D-LC preferred over lower-density 0.100" pitch alternatives?
The TFM-139-04-H-D-LC is preferred in aerospace, defense, and medical sectors where board real estate is scarce and 78 signals must be interconnected reliably. Its 0.050" pitch provides twice the contact density of a 0.100" pitch connector, and the Tiger Eye contact ensures reliable performance through thousands of mating cycles that standard contacts at 0.100" pitch cannot match.
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