TFM-138-22-L-D-A-P-TR SAMTEC Connector (Other) In Stock
The TFM-138-22-L-D-A-P-TR is a SAMTEC Tiger Eye high-reliability dual-row terminal strip with 0.050-inch pitch, 38 positions per row, and a long-body SMT profile for enhanced mechanical retention. It provides 76 total contacts with alignment posts and polarization keying for automated assembly worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TFM-138-22-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-138-22-L-D-A-P-TR?
- 0.050-inch (1.27 mm) pitch dual-row configuration provides 76 contacts in a board space equivalent to a 38-pin 0.100-inch single-row connector
- Long-body (-L) housing increases PCB solder joint area for improved mechanical pull strength and vibration resistance compared to standard TFM body variants
- Alignment post (-A) and polarization (-P) features prevent incorrect mating orientation during automated PCB assembly and field maintenance
- Tiger Eye dual-wipe contact geometry maintains contact resistance below 30 mΩ across repeated thermal cycling from -55°C to +125°C
What is TFM-138-22-L-D-A-P-TR used for?
The TFM-138-22-L-D-A-P-TR is designed for high-density board-to-board and mezzanine card interconnect in defense, aerospace, and industrial control systems requiring 76-contact signal routing at 0.050-inch pitch. It suits data acquisition cards, RF transceiver daughter boards, and FPGA-based processing modules where many differential signal pairs, power rails, and ground lines must share a single compact connector. The long-body design and polarization keying make it suitable for rack-mounted systems subject to vibration and frequent board insertions.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-138-22-L-D-A-P-TR datasheet?
TFM-138-22-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-138-22-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What total contact count and pitch does the TFM-138-22-L-D-A-P-TR provide?
The TFM-138-22-L-D-A-P-TR delivers 76 total contacts in a dual-row layout with 38 positions per row at 0.050-inch (1.27 mm) pitch. This enables routing of 38 differential signal pairs, or combinations of single-ended signals, power rails at up to 1 A per contact, and multiple ground return paths within a connector footprint of approximately 48 mm in length.
How does the long-body (-L) option of TFM-138-22-L-D-A-P-TR benefit installations in vibration-prone environments?
The long-body option extends the connector housing beyond the standard TFM envelope, increasing solder pad contact length and distributing mechanical load across a larger interface area. In vibration environments meeting MIL-STD-810G Method 514.7 profiles, the extended solder joints sustain lateral forces up to 30% higher compared to standard-length body variants, reducing the risk of fatigue cracks in solder fillets at the PCB pad edges over 10,000 vibration hours.
Which mating receptacle family is compatible with the TFM-138-22-L-D-A-P-TR for board-to-board stacking?
The TFM-138-22-L-D-A-P-TR mates with SAMTEC's TFM-compatible receptacle headers in the SSM, SFM, or TSM series configured for 0.050-inch pitch dual-row layouts with 38 positions per row. Mating stack heights range from approximately 3.2 mm to 15 mm depending on the receptacle body style selected, supporting flexible PCB separation distances in compact stacked module designs.
Can TFM-138-22-L-D-A-P-TR be used in a design requiring AEC-Q200 qualified passive components?
The TFM-138-22-L-D-A-P-TR is a connector, not a passive component, so AEC-Q200 qualification (which applies to resistors, capacitors, and inductors) is not directly applicable. However, SAMTEC's TFM series connectors are designed to withstand automotive-relevant temperature ranges from -55°C to +125°C and humidity exposure consistent with automotive interior environments, making them functionally compatible with automotive electronic systems requiring reliable board-to-board connections at 76-contact density.
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