TFM-138-22-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-138-22-H-D-A-P-TR is a high-reliability Tiger Eye dual-row SMT terminal strip with 76 pins on a 0.050 inch (1.27 mm) pitch, offered in a high-profile (H) variant for board-to-board stacking interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TFM-138-22-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-138-22-H-D-A-P-TR?
- Dual-row 76-pin SMT Tiger Eye connector on 0.050 inch (1.27 mm) pitch supports high-density board-to-board signal routing in compact modules
- High-profile (H) standoff height accommodates components between stacked boards in mezzanine and SOM interconnect assemblies
- Tape-and-reel (TR) format enables automated pick-and-place assembly, reducing placement cycle time in volume PCB production
What is TFM-138-22-H-D-A-P-TR used for?
The TFM-138-22-H-D-A-P-TR serves as a high-density board-to-board interconnect for system-on-module (SOM) carrier boards, FPGA mezzanine cards, and industrial computing platforms. Its 76-pin dual-row layout on 1.27 mm pitch provides up to 76 signal channels while the high-profile standoff creates clearance for surface-mounted components on the opposing board. Tape-and-reel packaging enables seamless SMT production line integration with standard automated assembly equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-138-22-H-D-A-P-TR datasheet?
TFM-138-22-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-138-22-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pin count and pitch of the TFM-138-22-H-D-A-P-TR connector?
The TFM-138-22-H-D-A-P-TR features 76 pins arranged in 2 rows on a 0.050 inch (1.27 mm) pitch, providing 76 signal channels in a compact SMT footprint suitable for high-density mezzanine and SOM board-to-board interconnects.
What advantage does the high-profile (H) designation provide in stacked-board PCB assemblies?
The high-profile (H) variant increases the mated board separation height compared to standard or low-profile TFM connectors, creating space for 0402 and 0603 SMT components mounted between two stacked boards, which is critical in SOM-carrier designs where both surfaces need populated components.
How does TFM-138-22-H-D-A-P-TR compare to a lower pin-count TFM connector for FPGA I/O expansion?
With 76 pins at 1.27 mm pitch, TFM-138-22-H-D-A-P-TR provides significantly more I/O channels than a 40-pin or 60-pin TFM variant, making it the preferred choice for FPGA expansion cards that require more than 60 signal lines while keeping the board footprint within the standard Tiger Eye SMT land-pattern envelope.
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