TFM-138-02-FM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-138-02-FM-D-LC is a 76-position high-reliability Tiger Eye terminal strip with 0.050 inch pitch, dual-row, vertical surface-mount, low-clearance configuration. Designed for demanding PCB interconnect applications. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TFM-138-02-FM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-138-02-FM-D-LC?
- 76-position dual-row vertical surface-mount configuration at 0.050 inch (1.27 mm) pitch for high-density signal routing
- Tiger Eye contact technology provides reliable wipe-action mating with consistent low contact resistance across the full 76-pin array
- Low-clearance (LC) profile minimizes above-board height enabling slim multi-board stacking and space-constrained designs
What is TFM-138-02-FM-D-LC used for?
The TFM-138-02-FM-D-LC is used in high-density board-to-board interconnect applications across telecom switching equipment, industrial automation controllers, and test and measurement systems. Its 76-position dual-row layout at 0.050 inch pitch enables efficient signal routing in compact vertical surface-mount configurations where high pin counts and reliable performance are required.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-138-02-FM-D-LC datasheet?
TFM-138-02-FM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-138-02-FM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TFM-138-02-FM-D-LC provide, and what mounting orientation does it use?
The TFM-138-02-FM-D-LC provides 76 positions arranged in a dual-row vertical surface-mount configuration at 0.050 inch (1.27 mm) pitch. The vertical mounting orientation keeps connector height perpendicular to the PCB, making it suitable for edge-coupled mezzanine designs where the 76-pin array must align precisely with a mating receptacle on the adjacent board.
Can the TFM-138-02-FM-D-LC withstand the thermal cycling requirements of industrial automation environments?
Yes, the TFM-138-02-FM-D-LC is built with Tiger Eye contact technology rated for operating temperatures from -55°C to +125°C, making it suitable for industrial automation environments subject to wide thermal cycling. The 76-position dual-row surface-mount design also provides robust solder joint integrity that withstands repeated thermal stress, ensuring reliable signal connections in control system backplanes and I/O modules.
What is the board-to-board spacing benefit of the low-clearance profile in the TFM-138-02-FM-D-LC?
The low-clearance (LC) designation on the TFM-138-02-FM-D-LC indicates a reduced above-board connector height, typically enabling board-to-board stacking clearances of less than 8 mm. This compact vertical profile allows system designers to fit 76 signal connections between tightly spaced PCBs in slim chassis or multi-board modules without exceeding height budgets, a key advantage in dense rack-mount telecom and computing platforms.
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