TFM-138-01-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-138-01-S-D-A-P-TR is a high-reliability Tiger Eye terminal strip at 0.050 inch (1.27 mm) pitch with a dual-row, 38-position-per-row, standard-height SMT configuration in tape-and-reel packaging. It delivers 76 total contacts with anti-rotation pegs for precise placement on high-density PCBs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 76
- Lifecycle
- ACTIVE
- Datasheet
- TFM-138-01-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-138-01-S-D-A-P-TR?
- 38-position dual-row Tiger Eye terminal strip at 0.050 inch pitch providing 76 total contacts in tape-and-reel format for automated high-volume SMT assembly
- Anti-rotation peg (P suffix) anchors the connector body during 260 °C lead-free reflow, ensuring all 76 contact pads remain aligned to PCB land patterns
- Standard-height (S) profile with redundant Tiger Eye contacts achieves contact resistance below 20 milliohms across the full 76-pin interface
What is TFM-138-01-S-D-A-P-TR used for?
The TFM-138-01-S-D-A-P-TR is engineered for high-density SMT board-to-board interconnect in defense electronics, high-performance embedded computing, and scientific instrumentation where 76 simultaneous signal and power contacts at 0.050 inch pitch are required on a single connector. The tape-and-reel packaging enables fully automated pick-and-place assembly on high-volume production lines, reducing placement error at this fine pitch. Its standard-height profile and anti-rotation peg system provide reliable mechanical and electrical performance throughout the product lifecycle in demanding environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-138-01-S-D-A-P-TR datasheet?
TFM-138-01-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-138-01-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What total contact count does TFM-138-01-S-D-A-P-TR provide, and which processor or FPGA bus architectures does it accommodate?
The TFM-138-01-S-D-A-P-TR provides 76 total contacts across 2 rows of 38 positions at 0.050 inch (1.27 mm) pitch. This is sufficient for a 64-bit data bus plus 12 control, power, and ground lines, making it well suited for FPGA module interfaces, high-speed DSP daughter cards, and multi-channel ADC/DAC boards in aerospace and defense processing systems.
How does the standard-height (S) profile of TFM-138-01-S-D-A-P-TR differ from low-profile (L) or high-profile (H) variants for stacked PCB designs?
The standard-height S suffix of TFM-138-01-S-D-A-P-TR sets a mid-range mated stack height, typically between 5 mm and 8 mm between the two PCBs. Low-profile variants allow closer board stacking below 5 mm, while high-profile variants accommodate stacks above 8 mm. The standard height balances contact engagement depth with reasonable inter-board clearance in rack-mount electronics and embedded module carriers.
Why does TFM-138-01-S-D-A-P-TR include anti-rotation pegs, and what problems do they prevent during SMT reflow?
The anti-rotation pegs (P suffix) on TFM-138-01-S-D-A-P-TR insert into matching PCB holes and physically restrain the 76-contact connector body from rotating or shifting when solder paste melts during reflow at temperatures up to 260 °C. Without these pegs, surface tension forces during reflow can rotate fine-pitch connectors by 0.5 mm or more, causing pad misalignment, solder bridges, or open circuits across the 0.050 inch pitch contact array.
For purchasing engineers, how does tape-and-reel packaging of TFM-138-01-S-D-A-P-TR reduce per-unit assembly cost in high-volume production?
Tape-and-reel packaging of TFM-138-01-S-D-A-P-TR delivers parts in a continuous carrier reel, typically holding 500 or more connectors, that feeds directly into automated pick-and-place machines. This eliminates hand-loading and orientation steps that add 15 to 30 seconds per connector at 76 contacts, and reduces the risk of ESD damage or pin contamination compared to loose-piece or tube packaging, lowering total installed cost per board in volumes above 1000 units.
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