TFM-137-03-H-D-LC SAMTEC Connector (Other) In Stock
The TFM-137-03-H-D-LC is a 74-position, dual-row Tiger Eye high-reliability terminal strip from SAMTEC with 0.050" (1.27 mm) pitch, offered in a high-profile vertical SMT package for demanding board-to-board interconnect applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Datasheet
- TFM-137-03-H-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-137-03-H-D-LC?
- 74-position dual-row layout at 0.050" (1.27 mm) pitch delivers high pin density in a compact SMT footprint under 50 mm
- High-profile (H) body height increases mated stack clearance for routing cables or flex circuits between connected boards
- Tiger Eye contacts maintain contact resistance below 20 mΩ across all 74 positions through extended thermal cycling from -55°C to +125°C
- Low-insertion-force mating with reliable retention force makes the TFM-137-03-H-D-LC suitable for frequent board swap applications
What is TFM-137-03-H-D-LC used for?
The TFM-137-03-H-D-LC is used in FPGA evaluation boards, industrial computing platforms, and high-speed data acquisition systems requiring 74-pin dual-row interconnects at 1.27 mm pitch with increased body height for sub-board cable routing. Its high-profile variant allows flex ribbon cables or cooling ducts to pass between mated boards, making it popular in server blade assemblies and telecom equipment. Medical imaging systems and test instrumentation also specify this connector for multi-channel analog and digital signal routing where consistent contact quality across all 74 positions is essential over a wide operating temperature range.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-137-03-H-D-LC datasheet?
TFM-137-03-H-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-137-03-H-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why does the 'H' designation in TFM-137-03-H-D-LC matter for board-to-board stacking designs?
The 'H' suffix denotes a high-profile body height that increases the clearance between stacked boards when mated, providing space for flex cables, air cooling ducts, or component overhangs to pass between boards. This is critical when 74-pin bus routing coexists with SMD components taller than 3 mm on adjacent PCB surfaces.
What current and contact resistance specifications apply to the TFM-137-03-H-D-LC across all 74 positions?
Each of the 74 contacts in the TFM-137-03-H-D-LC is rated up to 1 A continuous current with a contact resistance below 20 mΩ, ensuring minimal signal loss across parallel data buses, differential pairs, or mixed power-and-signal channel assignments on FPGA carrier and industrial computing boards.
For a 74-channel FPGA daughter card, how much PCB area does the TFM-137-03-H-D-LC dual-row footprint occupy?
The dual-row 0.050" (1.27 mm) pitch arrangement fits 74 pins into approximately 48 mm of connector length with only 2.54 mm row spacing, consuming a PCB footprint of roughly 48 mm by 5 mm. This lets designers consolidate wide data buses in a fraction of the board space required by 2.00 mm or 2.54 mm pitch alternatives.
Is TFM-137-03-H-D-LC stocked for quick-turn procurement, and what is the typical packaging format?
The TFM-137-03-H-D-LC is typically available in tray or bulk packaging from authorized SAMTEC distributors, with many stocking locations worldwide offering same-day shipping for quantities of 25 to 500 pieces. Custom reel packaging can be arranged for high-volume orders exceeding 1,000 units per order.
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