TFM-137-01-STL-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-137-01-STL-D-A-P-TR is a high-reliability Tiger Eye terminal strip at 0.050-inch pitch with 74 dual-row right-angle SMT contacts and tape-and-reel packaging optimized for automated pick-and-place assembly. Delivers high-density signal routing with consistent solder joint quality. Available with worldwide same-day shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 74
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-137-01-STL-D-A-P-TR?
- 74 dual-row right-angle SMT contacts at 0.050-inch (1.27 mm) pitch providing high-density board-to-board signal routing in compact horizontal-clearance PCB layouts
- Tape-and-reel (TR) packaging supports automated SMT pick-and-place assembly at high throughput with consistent 0.050-inch pitch pad alignment for zero-defect reflow soldering
- STL solder tail geometry optimized for controlled fillet formation on fine-pitch pads, compatible with standard lead-free reflow profiles up to 260°C peak temperature
What is TFM-137-01-STL-D-A-P-TR used for?
The TFM-137-01-STL-D-A-P-TR serves high-density board-to-board interconnect applications in telecommunications switching systems, embedded computing platforms, and high-performance data acquisition modules where 74 right-angle SMT contacts at 0.050-inch pitch maximize signal count within constrained PCB footprints. Its tape-and-reel packaging is well suited for automated contract manufacturing lines producing high volumes of communication and computing boards with minimal manual handling. Aerospace, defense, and industrial automation systems also use this connector for its Tiger Eye mating geometry, which provides reliable retention and stable contact resistance from -55°C to +125°C.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-137-01-STL-D-A-P-TR datasheet?
TFM-137-01-STL-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-137-01-STL-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does TFM-137-01-STL-D-A-P-TR have, and what orientation does it use for board-to-board connections?
The TFM-137-01-STL-D-A-P-TR provides 74 contacts arranged in a dual-row right-angle surface-mount configuration at 0.050-inch (1.27 mm) pitch. The right-angle orientation directs the mating axis parallel to the PCB surface, enabling horizontal board-to-board interconnect in enclosures with limited vertical clearance between stacked boards or chassis sidewalls.
What solder reflow temperature does TFM-137-01-STL-D-A-P-TR support, and how does the STL geometry improve joint quality?
The TFM-137-01-STL-D-A-P-TR is rated for lead-free reflow at up to 260°C peak temperature, compatible with SAC305 solder paste and standard IPC/JEDEC reflow profiles. The STL (solder tail length) geometry controls the lead standoff height and pad overlap, producing consistent fillet volumes on 0.050-inch pitch pads. This reduces the incidence of insufficient-fillet and bridging defects on 74-pin fine-pitch footprints in production reflow.
When selecting between TFM-137-01-STL-D-A-P-TR and a 0.100-inch pitch right-angle SMT connector for a new card design, what is the key trade-off?
The TFM-137-01-STL-D-A-P-TR at 0.050-inch (1.27 mm) pitch fits 74 contacts in roughly half the board-edge length of a 0.100-inch (2.54 mm) pitch equivalent with the same pin count. The main trade-off is that 0.050-inch pitch requires tighter PCB trace routing and more precise stencil aperture control during solder paste printing. For designs where PCB area is the binding constraint and the manufacturing process supports fine-pitch SMT, the TFM-137 series delivers a significant space advantage.
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