TFM-135-32-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-135-32-H-D-A-P-TR is a high-reliability Tiger Eye dual-row terminal strip offering 70 pins at 0.050" pitch for dense board-to-board interconnects. P-spec performance ensures robust contact integrity in defense, aerospace, and industrial applications. Tape and reel packaging enables automated SMT assembly with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TFM-135-32-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-135-32-H-D-A-P-TR?
- 35-position dual-row layout delivering 70 pins at 0.050" (1.27 mm) pitch for high-density board-to-board connections
- P-spec high-reliability contacts with tighter tolerances for defense, aerospace, and industrial grade performance
- Tape and reel (TR) supply format optimized for automated SMT pick-and-place high-volume production
What is TFM-135-32-H-D-A-P-TR used for?
The TFM-135-32-H-D-A-P-TR is engineered for high-density board-to-board and mezzanine stack applications in defense avionics, aerospace control modules, and industrial automation systems. With 70 pins at 0.050" pitch and P-spec reliability, it maximizes signal density while meeting stringent performance requirements under shock, vibration, and wide temperature extremes. The SMT tape and reel format integrates seamlessly into automated high-volume PCB assembly workflows.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-135-32-H-D-A-P-TR datasheet?
TFM-135-32-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-135-32-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many pins does TFM-135-32-H-D-A-P-TR provide and at what pitch?
TFM-135-32-H-D-A-P-TR features 35 positions per row in a dual-row configuration, yielding 70 pins total at a 0.050" (1.27 mm) pitch. This high-density footprint suits mezzanine, piggyback, and backplane board-to-board interconnect applications where maximum signal count within a minimal PCB footprint is required.
What does the P-spec designation guarantee for TFM-135-32-H-D-A-P-TR in rugged environments?
P-spec is SAMTEC's high-reliability contact specification with tighter dimensional tolerances, enhanced plating quality, and stronger contact retention forces. In TFM-135-32-H-D-A-P-TR with 70 pins at 0.050" pitch, P-spec ensures sustained electrical integrity under mechanical shock, vibration, and wide temperature cycling typical of defense, aerospace, and demanding industrial environments.
Is TFM-135-32-H-D-A-P-TR suitable for lead-free automated reflow assembly?
Yes, TFM-135-32-H-D-A-P-TR supports lead-free SMT reflow soldering at peak temperatures up to 260°C per JEDEC J-STD-020. The tape and reel packaging format enables precise automated pick-and-place of all 70 pins, maintaining consistent placement accuracy across high-volume production runs in defense and commercial board manufacturing.
What temperature range can TFM-135-32-H-D-A-P-TR reliably operate across?
TFM-135-32-H-D-A-P-TR with P-spec contacts is designed to maintain reliable performance from -55°C to +125°C, covering the full range of defense and aerospace environmental specifications. This thermal robustness, combined with 70 pins at 0.050" pitch, makes it the preferred mezzanine interconnect for avionics, rugged embedded computers, and industrial automation controllers.
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