TFM-135-21-S-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-135-21-S-D is a 70-position (35x2) single-row board receptacle connector with 0.050 inch pitch and gold-over-nickel mating contacts for reliable signal integrity. The compact 1.875 x 0.225 inch body offers fine-pitch density for space-constrained backplane and mezzanine card interfaces. RoHS compliant with tin-nickel termination contacts for standard SMT assembly processes.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TFM-135-21-S-D Datasheet PDF
- Category
- Connector
- Price
- From $5.4798(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-135-21-S-D?
- 70-position (35x2) dual-row receptacle with ultra-fine 0.050 inch (1.27 mm) pitch
- 30 micro-inch gold over 50 micro-inch nickel mating contacts for low-loss signal connections
- Compact body of 1.875 x 0.225 inch enabling high-density PCB mezzanine interfaces
- RoHS compliant with tin-nickel termination finish for lead-free assembly
- Short lead time of approximately 2 weeks for production scheduling flexibility
What is TFM-135-21-S-D used for?
The TFM-135-21-S-D is designed for high-density mezzanine board-to-board interconnects in telecommunications equipment, embedded computing modules, and FPGA development platforms where 0.050 inch pitch connectors are required. Its gold-plated contacts and rigid receptacle body make it suitable for high-cycle-count SOM/SBC applications and test fixture interfaces requiring reliable 70-pin signal connections.
What are the specifications of TFM-135-21-S-D?
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 5 Days |
| YTEOL | 9.15 |
| Additional Feature | ROHS COMPLIANT |
| Body Breadth | 0.225inch |
| Body Length | 1.875inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 70 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Where can I find the TFM-135-21-S-D datasheet?
TFM-135-21-S-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-135-21-S-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TFM-135-21-S-D have for mezzanine board designs?
The SAMTEC TFM-135-21-S-D features a 0.050 inch (1.27 mm) pitch and 70 positions in a dual-row configuration (35 per row), housed in a body measuring 1.875 x 0.225 inch. This high-density arrangement is ideal for mezzanine and SOM connector interfaces requiring many signal lines in a minimal PCB footprint.
What contact plating does the TFM-135-21-S-D use and how does this affect connector longevity?
The TFM-135-21-S-D uses 30 micro-inch gold over 50 micro-inch nickel on mating contacts, providing excellent corrosion resistance and low contact resistance over many mating cycles. The tin-nickel termination at the board end ensures robust solder joints during reflow assembly. Gold contact plating typically supports over 100 mating cycles reliably.
How quickly can the TFM-135-21-S-D be sourced for a new production program?
The TFM-135-21-S-D has a factory lead time of approximately 2 weeks and 5 days, which is notably short for a fine-pitch connector. This makes it practical for NPI programs and bridge production runs. Buyers should confirm stock with authorized SAMTEC distributors to avoid procurement gaps during high-demand periods.
What are typical applications for the TFM-135-21-S-D fine-pitch receptacle in embedded systems?
The TFM-135-21-S-D at 0.050 inch pitch is widely used on FPGAs, system-on-module boards, and high-speed signal backplanes where signal densities exceeding 50 pins per connector are needed. With 70 positions it can carry differential pairs, single-ended GPIOs, power rails, and control signals simultaneously across a 1.875 inch board edge interface.
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Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $24.7400 | $24.74 |
| 50+ | $8.7600 | $438.00 |
| 100+ | $7.9500 | $795.00 |
| 250+ | $6.5373 | $1634.34 |
| 500+ | $5.9940 | $2997.01 |
| 1000+ | $5.4798 | $5479.76 |
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