TFM-135-21-S-D SAMTEC Connector (Other) In Stock

SAMTEC TFM-135-21-S-D is a 70-position (35x2) single-row board receptacle connector with 0.050 inch pitch and gold-over-nickel mating contacts for reliable signal integrity. The compact 1.875 x 0.225 inch body offers fine-pitch density for space-constrained backplane and mezzanine card interfaces. RoHS compliant with tin-nickel termination contacts for standard SMT assembly processes.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-135-21-S-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
70
Lifecycle
ACTIVE
Category
Connector
Price
From $5.4798(MOQ 1)
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of TFM-135-21-S-D?

  • 70-position (35x2) dual-row receptacle with ultra-fine 0.050 inch (1.27 mm) pitch
  • 30 micro-inch gold over 50 micro-inch nickel mating contacts for low-loss signal connections
  • Compact body of 1.875 x 0.225 inch enabling high-density PCB mezzanine interfaces
  • RoHS compliant with tin-nickel termination finish for lead-free assembly
  • Short lead time of approximately 2 weeks for production scheduling flexibility

What is TFM-135-21-S-D used for?

The TFM-135-21-S-D is designed for high-density mezzanine board-to-board interconnects in telecommunications equipment, embedded computing modules, and FPGA development platforms where 0.050 inch pitch connectors are required. Its gold-plated contacts and rigid receptacle body make it suitable for high-cycle-count SOM/SBC applications and test fixture interfaces requiring reliable 70-pin signal connections.

What are the specifications of TFM-135-21-S-D?

Pbfree CodeYes
Factory Lead Time2 Weeks, 5 Days
YTEOL9.15
Additional FeatureROHS COMPLIANT
Body Breadth0.225inch
Body Length1.875inch
Body/Shell StyleRECEPTACLE
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (30) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting Option 1GUIDE SLOT
Mounting Option 2LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness30u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)3.2A
Reference StandardUL, CSA
Terminal Pitch1.27mm
Termination TypeSOLDER
Total Number of Contacts70
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Where can I find the TFM-135-21-S-D datasheet?

TFM-135-21-S-D Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TFM-135-21-S-D?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pitch and position count does the TFM-135-21-S-D have for mezzanine board designs?

The SAMTEC TFM-135-21-S-D features a 0.050 inch (1.27 mm) pitch and 70 positions in a dual-row configuration (35 per row), housed in a body measuring 1.875 x 0.225 inch. This high-density arrangement is ideal for mezzanine and SOM connector interfaces requiring many signal lines in a minimal PCB footprint.

What contact plating does the TFM-135-21-S-D use and how does this affect connector longevity?

The TFM-135-21-S-D uses 30 micro-inch gold over 50 micro-inch nickel on mating contacts, providing excellent corrosion resistance and low contact resistance over many mating cycles. The tin-nickel termination at the board end ensures robust solder joints during reflow assembly. Gold contact plating typically supports over 100 mating cycles reliably.

How quickly can the TFM-135-21-S-D be sourced for a new production program?

The TFM-135-21-S-D has a factory lead time of approximately 2 weeks and 5 days, which is notably short for a fine-pitch connector. This makes it practical for NPI programs and bridge production runs. Buyers should confirm stock with authorized SAMTEC distributors to avoid procurement gaps during high-demand periods.

What are typical applications for the TFM-135-21-S-D fine-pitch receptacle in embedded systems?

The TFM-135-21-S-D at 0.050 inch pitch is widely used on FPGAs, system-on-module boards, and high-speed signal backplanes where signal densities exceeding 50 pins per connector are needed. With 70 positions it can carry differential pairs, single-ended GPIOs, power rails, and control signals simultaneously across a 1.875 inch board edge interface.

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
From $5.4798
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
1+$24.7400$24.74
50+$8.7600$438.00
100+$7.9500$795.00
250+$6.5373$1634.34
500+$5.9940$2997.01
1000+$5.4798$5479.76
pcs
Unit price: $24.7400 · Total: $24.74

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK