TFM-135-01-FM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-135-01-FM-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050 inch pitch, dual-row 70-pin board stacking connector featuring female mating contacts and press-fit retention peg for SMT assembly. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TFM-135-01-FM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-135-01-FM-D-A-P-TR?
- 0.050" pitch dual-row 70-position board stacking connector for high-density signal interconnects in compact PCB designs
- Female mating contacts (FM) with gold plating over phosphor bronze for low contact resistance and long service life
- Tape-and-reel (TR) packaging with press-fit peg for automated SMT pick-and-place assembly in high-volume production
What is TFM-135-01-FM-D-A-P-TR used for?
The TFM-135-01-FM-D-A-P-TR is ideal for high-density board-to-board stacking applications in telecom equipment, industrial automation, and embedded computing systems requiring reliable 70-pin signal routing. Its female mating contact configuration and 0.050 inch pitch make it a versatile solution for compact daughtercard and mezzanine board connections. The tape-and-reel format supports efficient automated assembly in high-volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-135-01-FM-D-A-P-TR datasheet?
TFM-135-01-FM-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-135-01-FM-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many total contact positions does the TFM-135-01-FM-D-A-P-TR provide for board stacking?
The TFM-135-01-FM-D-A-P-TR provides 70 total contact positions arranged in a dual-row configuration at a 0.050 inch pitch, enabling high-density signal routing between stacked PCBs. This large contact count makes it suitable for high-bandwidth data and power distribution in telecom and embedded systems with 35 positions per row.
What assembly process does the TFM-135-01-FM-D-A-P-TR tape-and-reel packaging support?
The TR suffix designates tape-and-reel packaging compatible with automated SMT pick-and-place equipment, allowing efficient placement in high-volume manufacturing lines at reflow temperatures up to 260°C. The integrated press-fit retention peg secures the connector to the PCB before soldering, reducing misalignment defects in large-scale production runs.
When should a designer choose TFM-135-01-FM-D-A-P-TR over a lower-density alternative for a mezzanine board design?
A designer should select the TFM-135-01-FM-D-A-P-TR when a mezzanine board requires 70 or more signal lines at 0.050 inch pitch within a constrained PCB footprint. Compared to 0.100 inch pitch alternatives, the 0.050 inch pitch reduces board space by roughly 50%, making it the preferred choice for communications blades and high-density embedded modules needing more than 48 pins.
What contact material and finish does the TFM-135-01-FM-D-A-P-TR use for long-term reliability?
The TFM-135-01-FM-D-A-P-TR uses phosphor bronze contacts with gold plating on the mating interface, providing stable contact resistance below 20 milliohms over thousands of mating cycles. Gold plating resists oxidation across industrial operating temperatures from -55°C to +125°C, ensuring reliable signal integrity in harsh environments.
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