TFM-132-01-H-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-132-01-H-D-A-P-TR is a high-reliability Tiger Eye dual-row horizontal SMT terminal strip with 64 positions at 0.050 inch (1.27 mm) pitch, supplied in tape-and-reel packaging for automated assembly. Available globally with fast shipping for dense mezzanine and module interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- TFM-132-01-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-132-01-H-D-A-P-TR?
- Tiger Eye dual-wipe contact technology ensures stable low contact resistance on all 64 pins across thousands of mating cycles at 0.050 inch pitch
- Horizontal SMT (H) orientation reduces connector height above the PCB for low-profile stacked board and mezzanine card designs
- Tape-and-reel (TR) packaging enables fully automated high-volume pick-and-place assembly, critical for 64-pin fine-pitch SMT connectors
What is TFM-132-01-H-D-A-P-TR used for?
The TFM-132-01-H-D-A-P-TR is designed for high-reliability board-to-board and module interconnect applications in aerospace, defense electronics, and advanced instrumentation requiring 64 positions at 0.050 inch (1.27 mm) pitch in a horizontal low-profile SMT footprint. Its Tiger Eye contacts and tape-and-reel packaging make it ideal for automated production of FPGA mezzanine cards, data acquisition modules, and radar signal processing boards. This connector supports both high-speed digital signals and low-current power lines in a single compact horizontal SMT package.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-132-01-H-D-A-P-TR datasheet?
TFM-132-01-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-132-01-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the horizontal SMT orientation of the TFM-132-01-H-D-A-P-TR benefit multi-board stack assemblies?
The horizontal (H) SMT orientation of the TFM-132-01-H-D-A-P-TR places the 64-pin, 0.050 inch pitch connector body parallel and close to the PCB surface, significantly reducing the vertical height contribution compared to vertical SMT or through-hole variants. In a multi-board stack where inter-board clearance may be only 3 mm to 5 mm, the low-profile horizontal orientation allows more boards to fit within a constrained enclosure height without sacrificing connector contact count.
Why is tape-and-reel packaging especially important for a fine-pitch 64-pin SMT connector like the TFM-132-01-H-D-A-P-TR?
At 0.050 inch (1.27 mm) pitch, the 64 solder pads are closely spaced, making manual placement error-prone and increasing the risk of solder bridging. Tape-and-reel (TR) packaging allows a pick-and-place machine to achieve placement accuracy within micrometers, which is essential for reliable solder joints on fine-pitch SMT connectors. This is especially critical in aerospace and defense production where every solder joint must pass strict inspection criteria.
Is the TFM-132-01-H-D-A-P-TR an appropriate choice for high-speed digital signals, and what signal integrity considerations apply?
The TFM-132-01-H-D-A-P-TR at 0.050 inch (1.27 mm) pitch supports high-speed digital signal routing between boards, with the Tiger Eye contact design minimizing contact resistance and stub effects. For signal speeds above 1 GHz, designers should consult SAMTEC's published insertion loss and impedance data for the TFM series and implement ground-signal-ground contact assignment strategies within the 64-position dual-row layout to maintain signal integrity across differential pairs.
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