TFM-130-01-S-D-RA SAMTEC Connector (Other) In Stock
The SAMTEC TFM-130-01-S-D-RA is a 60-position dual-row right-angle board stacking connector measuring 1.625 x 0.225 x 0.22 inch, with 30 µin gold over nickel mating contacts and matte tin termination. RoHS compliant with a one-week lead time. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFM-130-01-S-D-RA Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row right-angle board stacking connector with 1.625 inch body length for dense PCB-to-PCB interconnects
- 30 µin gold over 50 µin nickel mating contact finish ensures low contact resistance and long insertion life
- Compact 0.225 x 0.22 inch cross-section profile minimizes stack height in tight board-to-board assembly
- RoHS-compliant construction with 1-week factory lead time for fast procurement in production schedules
Applications
The TFM-130-01-S-D-RA dual-row right-angle board stacking connector is used in embedded computing systems, FPGA development boards, and modular industrial controllers where compact 60-position PCB-to-PCB interconnects are required. Its right-angle orientation and gold-plated mating contacts suit applications such as mezzanine card assemblies, signal acquisition modules, and telecom line cards that demand reliable low-resistance connections across stacked board assemblies.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.65 |
| Additional Feature | ROHS COMPLIANT |
| Body Breadth | 0.225inch |
| Body Depth | 0.22inch |
| Body Length | 1.625inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | SHRD ENDS |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Length | 0.075inch |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the body size and position count of the TFM-130-01-S-D-RA connector?
The SAMTEC TFM-130-01-S-D-RA has a body length of 1.625 inch, body breadth of 0.225 inch, and body depth of 0.22 inch, providing 60 positions in a dual-row right-angle board stacking configuration for high-density PCB-to-PCB interconnects in embedded and telecom systems.
What contact finish does the TFM-130-01-S-D-RA use and how does it affect connector lifespan?
The TFM-130-01-S-D-RA features 30 µin gold plating over 50 µin nickel on the mating contacts, providing excellent corrosion resistance and consistent low contact resistance across many thousands of mating cycles. Matte tin over nickel on the termination side ensures strong solder joint reliability for the 60-position dual-row through-hole footprint.
How quickly can the TFM-130-01-S-D-RA be procured and is it environmentally compliant?
The SAMTEC TFM-130-01-S-D-RA has a factory lead time of just 1 week, enabling rapid procurement for time-sensitive production schedules. It carries a Pbfree Code of Yes and RoHS-compliant marking, with a YTEOL of 8.65 years, confirming environmental compliance for use in commercial and industrial end products.
Which board stacking designs benefit most from the TFM-130-01-S-D-RA's right-angle orientation?
The right-angle orientation of the TFM-130-01-S-D-RA is ideal for mezzanine card assemblies, horizontal PCB stacking in enclosures, and edge-launch interconnects in FPGA boards and signal acquisition modules, where 60 dual-row positions must route signals perpendicularly from one board plane to another within a constrained 0.22-inch profile.
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