TFM-130-01-H-D-A-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TFM-130-01-H-D-A-P-TR is a 60-position dual-row high-reliability Tiger Eye terminal strip with 0.050" (1.27 mm) pitch in a horizontal surface-mount configuration with polarization peg and tape-and-reel packaging. Engineered for precision board-to-board signal routing in automated SMT assembly environments. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFM-130-01-H-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-130-01-H-D-A-P-TR?
- 60-position dual-row layout on 0.050" (1.27 mm) pitch enables high-density signal routing for compact board-to-board interconnect designs
- Tape-and-reel (TR) packaging supports high-volume automated SMT pick-and-place assembly, reducing handling time and placement errors
- Polarization peg (P) prevents incorrect orientation during mating, ensuring all 60 signal positions connect correctly in production and field applications
What is TFM-130-01-H-D-A-P-TR used for?
The TFM-130-01-H-D-A-P-TR is designed for high-volume automated SMT production of FPGA mezzanine modules, embedded computing daughter boards, and telecom line cards requiring 60 signals in a fine 0.050" pitch horizontal footprint. The tape-and-reel packaging integrates seamlessly with automated pick-and-place equipment, making it ideal for production environments that prioritize throughput and placement accuracy across large PCB batch runs. Its polarization peg also suits applications where the connector must be correctly oriented by assembly operators or robotic systems before reflow.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-130-01-H-D-A-P-TR datasheet?
TFM-130-01-H-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-130-01-H-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why is the tape-and-reel packaging of the TFM-130-01-H-D-A-P-TR important for high-volume SMT production lines?
The tape-and-reel (TR) packaging allows automated pick-and-place machines to feed and place the 60-position connector without manual handling, significantly increasing throughput on SMT production lines assembling FPGA boards or telecom modules in volume. This packaging format reduces placement errors and handling damage compared to tray or bulk packaging, and is compatible with industry-standard reel sizes used in high-speed placement equipment.
How does the polarization peg on the TFM-130-01-H-D-A-P-TR prevent mis-mating in a 60-position board-to-board application?
The polarization peg physically restricts the mating header to one correct orientation, preventing the 60-position dual-row connector from being inserted 180 degrees reversed, which could damage signal lines operating at 3.3 V or 5 V logic. This mechanical keying feature is especially critical in field-service or prototyping environments where an operator might otherwise mis-orient the mating assembly without the peg guidance.
For which compact board stacking scenarios does the horizontal 0.050" pitch layout of the TFM-130-01-H-D-A-P-TR outperform a standard 0.100" dual-row header?
The horizontal 0.050" (1.27 mm) pitch layout routes 60 signals in roughly half the PCB footprint of a standard 0.100" (2.54 mm) pitch dual-row header carrying the same pin count, making it the superior choice for FPGA mezzanine stacks, compact server blades, and portable instruments where PCB real estate is scarce. The horizontal orientation also keeps the connector body parallel to the board surface, minimizing board-to-board gap height in slim mechanical enclosures where a vertical 0.050" strip would add excessive stack height.
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