TFM-128-01-SM-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-128-01-SM-D-A-P-TR is a Tiger Eye terminal strip at 0.050" pitch, 56-position dual-row, SMT with polarization and tape-and-reel packaging for high-volume automated assembly. Available with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 56
- Lifecycle
- ACTIVE
- Datasheet
- TFM-128-01-SM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 56-position dual-row surface-mount terminal strip at 0.050" (1.27 mm) pitch for high-density compact board interconnects
- Tape-and-reel (TR) packaging supports automated pick-and-place at volumes exceeding 3000 placements per hour
- Polarization (P) option provides mechanical keying to prevent mis-mating across all 56 contacts during assembly and field use
Applications
The TFM-128-01-SM-D-A-P-TR is used in high-volume SMT production of board-to-board and mezzanine interconnects in telecommunications, consumer electronics, and embedded computing. Its 56-position dual-row configuration at 0.050" pitch delivers dense signal routing within a minimal PCB footprint, while tape-and-reel packaging streamlines automated assembly. The polarization key eliminates reverse-insertion risk, which is critical given the fine 1.27 mm pitch where contact damage from misalignment would affect all 56 pins.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 56-position count of TFM-128-01-SM-D-A-P-TR compare to the TFM-125 variant for dense signal routing?
The TFM-128-01-SM-D-A-P-TR provides 56 positions versus 50 positions in the TFM-125 variant, both at 0.050" (1.27 mm) pitch in a dual-row SMT format. Designers requiring 6 additional signal channels without changing pitch or connector family can substitute TFM-128 for TFM-125 on the PCB, gaining 12% more contacts in a slightly larger footprint while maintaining identical assembly processes.
What production benefits does tape-and-reel packaging provide for TFM-128-01-SM-D-A-P-TR versus tray packaging?
Tape-and-reel packaging for the TFM-128-01-SM-D-A-P-TR eliminates manual tray-to-feeder loading steps, enabling continuous automated pick-and-place at rates exceeding 3000 placements per hour. This reduces assembly cycle time and operator handling errors for 56-pin 0.050" pitch connectors, which are sensitive to misalignment. Tape-and-reel also improves inventory management by enabling reel-count tracking compared to part-count estimation from trays.
For which SMT reflow profile is TFM-128-01-SM-D-A-P-TR qualified and what flux residue considerations apply?
The TFM-128-01-SM-D-A-P-TR is qualified for lead-free SMT reflow soldering with peak temperatures up to 260°C for a maximum of 10 seconds, per standard J-STD-020 guidelines. The 56-position 0.050" pitch layout requires careful solder paste volume control to prevent bridging between adjacent pads; a stencil thickness of 0.12 mm to 0.15 mm is typically recommended to balance paste volume and minimize flux residue trapped under the connector body.
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